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Polymer Property : Cure Time = 0.00556 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time >= 0.333 min
>= 0.00556 hour
Fixture
Resinlab® CYNERGY CA6603 Adhesive
Description: The CYNERGY 6600 SERIES are modified to provide greatly reduced odor and frosting of plastics. These products are ideal for bonding dissimilar materials with excellent performance on a ..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets  (discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed  (disc
Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage  (discontinued **)&
Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed  (discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **)
Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **)
Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak ..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin  (discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
Plastic set time
Lord Adhesives CA High Viscosity, General Purpose, Non Stringing, Non Migrating Ethyl Cyanoacrylate Adhesive
Lord Cyanoacrylate AdhesivesLord® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time 0.333 min
0.00556 hour
Primary Cure is UV: Full Cure in 20-40 seconds @ 70 mW/cm^2. Secondary Cure is Moisture: Tack free in 2-6 hours, Full cure in 72 hours.
Loctite® Shadowcure™ 5293 Silicone Coating
Conformal CoatingsConformal coatings are thin dielectric coatings that extend the longevity of circuit boards by protecting components and traces from corrosion, shorts, and mechanical damage. Locti..
Cure Time <= 0.333 min
<= 0.00556 hour
Dymax 930 Coil Terminating, Tamper proofing and Structural Electronic Bonder
High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 930 Coil Terminating, Tamper proofing and Structural Electronic BonderHigh strength, superior bonds to steel, alumin..
Cure Time 0.333 - 0.500 min
0.00556 - 0.00833 hour
per mm
Amity Thermosets ATF 197 Phenolic Molding Inorganic and glass Filler, Compression Molded
Characteristics:Flame retardantSpark resistant Good electrical insulationHeat stability ( 200°C )Good mouldability Low water absorptionLow shrinkageColor-blackSoft/medium flow Applications:Switchg..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
per mm
Amity Thermosets ATG 115 Phenolic Molding Organic Filler, Compression Molded
Characteristics:Medium mechanical strength Medium electrical insulationGeneral purposeColor- Black, BrownSoft/medium flow Applications: Electrical accessories & fittings ( medium quality ) Domestic ..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
per mm
Amity Thermosets ATM 122 Phenolic Molding Organic Filler, Compression Molded
Characteristics:Good mouldability Good mechanical strengthGood electrical insulationGood surface finishMedium thermal stabilityColor- black, brownSoft/medium flow Applications: Electric control pane..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
per mm
Amity Thermosets ATM 125 Phenolic Molding Organic Filler, Compression Molded
Characteristics:Glossy surface free of filler marks Surface good & free of flaws Good mouldabilitySurface free of filler marks even after turningGood mechanical strengthColor-black, brownSoft/medium..
Cure Time 0.333 - 0.500 min
0.00556 - 0.00833 hour
per mm
Amity Thermosets ATS 166 Phenolic Molding Chopped cotton fabric Filler, Compression Molded
Characteristics:High impact strengthGlossy surfaceLow shrinkageGood sliding propertiesColor-BlackMedium flowApplications:Cog wheelsCastor wheelsBush bearingsPulleysWelding rod handlesTextile bobbins..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
per mm
Amity Thermosets ATG 116 Phenolic Molding Organic and inorganic Filler, Compression Molded
Characteristics:Medium mechanical strength Medium electrical insulationGeneral purposeColor- BlackMedium flow Applications: Electrical accessories & fittings ( medium quality ) Domestic appliance ha..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
per mm
Amity Thermosets ATO 145 Phenolic Molding Organic Filler, Compression Molded
Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-black, brownMedium flow Applications: Electric ..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
Fixture Rate
Dymax Magnet Bonder™ 2010 Adhesive
DYMAX® Magnet Bonder™ Adhesives for Higher Performance and Lower CostDymax 2010 Magnet Bonder™ AdhesiveHigh performance; bond plated materials, E-coat Typical Use: D.C. motor magnet to can bond..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
Cure Time >= 0.333 min
>= 0.00556 hour
Fixture
Resinlab® CYNERGY CA6908 Adhesive
Description: The CYNERGY 6900 SERIES are for use in demanding applications where very fast cure speeds and high temperature resistance are required. These are single component solvent free materials..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..
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