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Polymer Property : Cure Time = 0.00556 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 0.0833 - 0.333 min
0.00139 - 0.00556 hour
fixture time, (low power 4mW lamp)
Permabond UV7141 UV-curable Adhesive
Permabond UV7141 is a UV-curable adhesive with a secondary anaerobic cure mechanism. This makes it ideal for bonding materials such as ceramic-coated glass, mirrors, etc. where UV-light cannot penet..
Cure Time 0.250 - 0.333 min
0.00417 - 0.00556 hour
Buna N Rubber, handling time
Permabond 240 Cyanoacrylate, gap filling
PERMABOND® 240 is a high viscosity product useful in large gap applications. It is ideal for porous substrates. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate..
Cure Time 0.250 - 0.333 min
0.00417 - 0.00556 hour
Phenolic, handling time
Permabond 240 Cyanoacrylate, gap filling
PERMABOND® 240 is a high viscosity product useful in large gap applications. It is ideal for porous substrates. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate..
Cure Time 0.250 - 0.333 min
0.00417 - 0.00556 hour
Steel, handling time
Permabond 920 Cyanoacrylate, High temperature
PERMABOND® 920 is the original allyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. PERMAB..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Phenolic, set time
Permabond 932 Cyanoacrylate
PERMABOND 932 is a low odor, non­fogging, non­frosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets  (discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength &
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs
Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed &nbs
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength  (discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive  (discontinued **)
Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed  (discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **)
Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **)
Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak ..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin  (discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Value given for curing at 300 W/in; Optimum properties in 24 hrs.
Humiseal 1C61 UV Cure Conformal Coating
Humiseal 1C61 UV Cure Conformal CoatingHigh temperature resistanceGood dielectrical propertiesGood moisture resistanceRepairableUL Approval PendingMIL-I-46058C Approval PendingPasses thermal shock t..
Cure Time 0.0833 - 0.333 min
0.00139 - 0.00556 hour
Plastic set time
Lord Adhesives 9010 Medium Viscosity, Odorless, Non-Frosting Methoxyethyl Cyanoacrylate Adhesive
Lord Cyanoacrylate AdhesivesLord® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion UP 802 Unsaturated Polyester Resin, High Surface Quality, Low Shrinkage, High Arc Resistance
Polyester molding compound, inorganically filled, glass fiber reinforced, styrene free, high dimensional stability, very slight post shrinkage, good mechanical properties, increased electrical value..
Cure Time 0.200 - 0.333 min
0.00333 - 0.00556 hour
per mm
Amity Thermosets ATI 101 Phenolic Molding Organic Filler, Injection Molded
Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-blackVery soft flow Applications: Electric swit..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Cooling Time
Advanced Polymer Alloys DuraGrip™ 6150 BK Melt Processable Elastomer
DuraGrip™ 6150BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6150BK has an excellent soft touch feel a..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6030 NC/BK Thermoplastic Elastomer (TPE)
DuraGrip® DGR 6030 NC/BK are designed to be general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6030 NC/BK have an excellent soft t..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6050 NC/BK Thermoplastic Elastomer (TPE)
DuraGrip® DGR 6050 NC/BK are designed to be general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6050 NC/BK have an excellent soft t..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs
Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..
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