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Polymer Property : Shelf Life = 1.00 Month Product List

Processing Properties

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Processing Properties Metric English Comments
Shelf Life 1.00 Month

@Temperature 23.9 °C
1.00 Month

@Temperature 75.0 °F
Quantum Composites QC-7753 50% Glass Fiber Reinforced Polyester SMC
QC-7753 is a polyester engineered structural composite molding compound that is designed for applications requiring high strength, fire retardant properties, and resistance to elevated temperatures...
Shelf Life 1.00 Month

@Temperature 23.9 °C
1.00 Month

@Temperature 75.0 °F
Quantum Composites QC-8777 41% Glass Fiber Reinforced Polyester Hybrid SMC
QC-8777 is a polyester hybrid engineered structural composite molding compound designed for compression molding of components requiring high structural strength, corrosion resistance and temperature..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-A Formed in Place Conductive Elastomer
Description: This compound is ideally suited to corrosion-concerned applications where the gasket is applied to an aluminum casting. The corrosion resistance is enhanced due to the galvanic compatib..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer
Description: This is the small particle version of the FIP-C compound. It was specifically designed for mobile cell phone applications, which require a high degree of EMI shielding. While the compou..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-C Formed in Place Conductive Elastomer
Description: This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommunications base stati..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-E (SP)` Formed in Place Conductive Elastomer
This is the small particle version of the Ag/glass (FIP E) compound that was specifically designed for the mobile cell phone applications. It should be noted that this compound offers a low compress..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-E Formed in Place Conductive Elastomer
Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value. The material is also available as a h..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-N (LD) Formed in Place Conductive Elastomer
Description: FIP-N is similar in performance to FIP-A elastomer and hence offers a good non-corrosive EMI shield in harsh conditions. This material is one of our more cost effective FIP compoundsInf..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-N Formed in Place Conductive Elastomer
Description: FIP-N is similar in performance to FIP-A elastomer and hence offers a good non-corrosive EMI shield in harsh conditions. This material is one of our more cost effective FIP compoundsInf..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-R Formed in Place Conductive Elastomer
Description: FIP-R is based on a very rugged pure silver particle. By using silver as the conductive medium, this compound offers great performance in terms of heat aged electrical conductive stabil..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ FIP-X Formed in Place Conductive Elastomer
Description: FIP-X is Tecknit’s newest compound and features a conductive powder that is a unique particle combining tungsten carbide and aluminum. The premium advantage of this compound is its ab..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer
Description: Heat cure compound. This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommu..
Shelf Life 1.00 Month
1.00 Month
Syringe
Parker Chomerics Tecknit Teckfip™ HC FIP-E Formed in Place Conductive Elastomer
Heat cure compound. Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value.Information provid..
Shelf Life 1.00 Month
1.00 Month
At 25°C
Tra-Con Tra-Bond 286-5 Latex Emulsion
TRA-BOND 286-5 latex emulsion is designed for temporary sealing of molds to prevent leaking during cure. This compound will thicken gradually due to water evaporation. Store containers with caps sec..
Shelf Life 1.00 Month

@Temperature -40.0 °C
1.00 Month

@Temperature -40.0 °F
Tra-Con Tra-Bond 724-5 Low Viscosity Polyurethane Adhesive
TRA-BOND 724-5 is a premixed and frozen, electrically insulating, polyurethane adhesive. This resilient adhesive exhibits good adhesion to a wide variety of substrates, including aluminum, solder, n..
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