Processing Properties | Metric | English | Comments |
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Gel Time | 4.00 min | 4.00 min | |
Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 6781 S2-Glass Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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Gel Time | 4.00 min | 4.00 min | |
Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 7781 E-Glass Reinforced Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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Gel Time | 4.00 min | 4.00 min | |
Northstar Polymers MSS-A70GQ High Performance Polyurethane Cast Elastomer System 70A This is a Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires cut/tear resistance, dry-abrasion resistance, slow resp.. |
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Gel Time | 4.00 min | 4.00 min | |
Northstar Polymers MSS-A80AQ High Performance Polyurethane Cast Elastomer System 80A This is a Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires high tensile strength, cut/tear resistance, dry-abrasio.. |
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Gel Time | 4.00 min | 4.00 min | |
Northstar Polymers MSS-A85BQ High Performance Polyurethane Cast Elastomer System 85A This is a Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires high tensile strength, cut/tear resistance, dry-abrasio.. |
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Gel Time | >= 4.00 min @Temperature 150 °C |
>= 4.00 min @Temperature 302 °F |
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Lord Adhesives Thermosetâ„¢ ME-455-1 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455-1 encapsulant is a low viscosity, one-component, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavi.. |
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Gel Time | 4.00 min @Temperature 150 °C |
4.00 min @Temperature 302 °F |
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Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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Gel Time | 4.00 min @Temperature 150 °C |
4.00 min @Temperature 302 °F |
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Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a .. |
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Gel Time | 4.00 - 10.0 min @Temperature 121 °C |
4.00 - 10.0 min @Temperature 250 °F |
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Hexcel® HexPly® F155 Epoxy Resin HexPly® F155 is an advanced modified epoxy formulation designed for autoclave curing to offer very high laminate strengths, coupled with increased fracture toughness and adhesive properties. HexPly.. |
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Gel Time | <= 4.00 min @Temperature 121 °C |
<= 4.00 min @Temperature 250 °F |
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Hexcel® HexPly® F522 Epoxy Resin HexPly® F522 is an advanced, modified epoxy formulation designed for autoclave curing to offer very high laminate strengths, coupled with increased fracture toughness, excellent hot-wet properties .. |