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Polymer Property : Gel Time = 4.00 min Product List

Processing Properties

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Processing Properties Metric English Comments
Gel Time 4.00 min
4.00 min
Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 6781 S2-Glass
Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle..
Gel Time 4.00 min
4.00 min
Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 7781 E-Glass Reinforced
Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle..
Gel Time 4.00 min
4.00 min
Northstar Polymers MSS-A70GQ High Performance Polyurethane Cast Elastomer System 70A
This is a Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires cut/tear resistance, dry-abrasion resistance, slow resp..
Gel Time 4.00 min
4.00 min
Northstar Polymers MSS-A80AQ High Performance Polyurethane Cast Elastomer System 80A
This is a Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires high tensile strength, cut/tear resistance, dry-abrasio..
Gel Time 4.00 min
4.00 min
Northstar Polymers MSS-A85BQ High Performance Polyurethane Cast Elastomer System 85A
This is a Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires high tensile strength, cut/tear resistance, dry-abrasio..
Gel Time >= 4.00 min

@Temperature 150 °C
>= 4.00 min

@Temperature 302 °F
Lord Adhesives Thermosetâ„¢ ME-455-1 Epoxy Board Level Encapsulant
LORD Thermosetâ„¢ ME-455-1 encapsulant is a low viscosity, one-component, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavi..
Gel Time 4.00 min

@Temperature 150 °C
4.00 min

@Temperature 302 °F
Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant
LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by..
Gel Time 4.00 min

@Temperature 150 °C
4.00 min

@Temperature 302 °F
Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant
CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a ..
Gel Time 4.00 - 10.0 min

@Temperature 121 °C
4.00 - 10.0 min

@Temperature 250 °F
Hexcel® HexPly® F155 Epoxy Resin
HexPly® F155 is an advanced modified epoxy formulation designed for autoclave curing to offer very high laminate strengths, coupled with increased fracture toughness and adhesive properties. HexPly..
Gel Time <= 4.00 min

@Temperature 121 °C
<= 4.00 min

@Temperature 250 °F
16
Hexcel® HexPly® F522 Epoxy Resin
HexPly® F522 is an advanced, modified epoxy formulation designed for autoclave curing to offer very high laminate strengths, coupled with increased fracture toughness, excellent hot-wet properties ..
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