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Polymer Property : Dielectric Strength = 10200 kV/in Product List

Electrical Properties

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Electrical Properties Metric English Comments
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ D Semiconductor Dielectric Resin
SiLK™ D resin provides a more controlled coefficient of thermal expansion (CTE) profile at elevated temperatures as compared to earlier versions of SiLK™ resin.Information provided by Dow
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I 1070 Semiconductor Dielectric Resin
SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I 130 Semiconductor Dielectric Resin
SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I 1500 Semiconductor Dielectric Resin
SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I 360 Semiconductor Dielectric Resin
SiLK™ I 360 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 360 is compatible with..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I 550 Semiconductor Dielectric Resin
SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I 620 Semiconductor Dielectric Resin
SiLK™ I 620 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 620 is compatible with..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I 820 Semiconductor Dielectric Resin
SiLK™ I 820 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 820 is compatible with..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I300 280 Semiconductor Dielectric Resin
SiLK™ I300 280 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 280 is compatibl..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I300 380 Semiconductor Dielectric Resin
SiLK™ I300 380 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 380 is compatibl..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I300 560 Semiconductor Dielectric Resin
SiLK™ I300 560 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 560 is compatibl..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I 260 Semiconductor Dielectric Resin
SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with..
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
Dow SiLK™ I300 140 Semiconductor Dielectric Resin
SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl..
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