Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound

Category Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer Aptek Laboratories
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications.Part A is a cloudy, unfilled polyol resin. Part B is a clear/hazy yellow organic isocyanate.Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 0.910 g/cc
0.0329 lb/in³
A Component; ASTM D1475
1.23 g/cc
0.0444 lb/in³
B Component; ASTM D1475
Moisture Absorption at Equilibrium 0.18 %
0.18 %
Cured property; ASTM D570
Viscosity 50 cP
50 cP
B Component; ASTM D1824
8000 cP
8000 cP
A Component; ASTM D1824
Outgassing - Total Mass Loss 0.38 %
0.38 %
Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.030 %
0.030 %
Cured property; at 10E-6 torr; ASTM E595
Mechanical Properties Metric English Comments
Hardness, Shore A 50 - 60
50 - 60
Cured property; ASTM D2240
Tensile Strength, Ultimate 3.31 MPa
480 psi
Cured property; ASTM D412
Elongation at Break 325 %
325 %
Cured property; ASTM D412
Modulus of Elasticity 0.00517 GPa
0.750 ksi
Cured property; ASTM D412
Adhesive Bond Strength 3.62 MPa
525 psi
Al-to-Al Lap Shear; Cured property; ASTM D1002
Thermal Properties Metric English Comments
CTE, linear 67.0 µm/m-°C

@Temperature 20.0 °C
37.2 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 1
220 µm/m-°C

@Temperature 20.0 °C
122 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 2
Thermal Conductivity 0.176 W/m-K
1.22 BTU-in/hr-ft²-°F
COLORA
Glass Transition Temp, Tg -65.0 °C
-85.0 °F
Cured property; JMTP P200
Flash Point >= 150 °C
>= 302 °F
B Component; ASTM D92
>= 200 °C
>= 392 °F
A Component; ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 8.80e+15 ohm-cm
8.80e+15 ohm-cm
Cured property; ASTM D257
Dielectric Constant 3.2

@Frequency 1000 Hz
3.2

@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength 14.6 kV/mm

@Thickness 12.7 mm
370 kV/in

@Thickness 0.500 in
Cured; ASTM D149
>= 78.7 kV/mm

@Thickness 0.127 mm
>= 2000 kV/in

@Thickness 0.00500 in
Cured; ASTM D149
Dissipation Factor 0.024

@Frequency 1000 Hz
0.024

@Frequency 1000 Hz
Cured property; ASTM D150
Processing Properties Metric English Comments
Processing Temperature 80.0 °C
176 °F
Cure 8 hrs.
100 °C
212 °F
Cure 4 hrs.
Copyright © lookpolymers.com All Rights Reserved