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Aremco Aremco-Bond™ 2315X High Temperature Epoxide Potting Compound

Category Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer Aremco
Trade Name Aremco-Bond™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aremco Aremco-Bond™ 2315X High Temperature Epoxide Potting Compound.pdf
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Material Notes:
Improved Crack Resistance & Bond Strength. High Temperature Resistance, Thermally Conductive, Low Viscosity.
Physical Properties Metric English Comments
Density 1.95 g/cc
0.0704 lb/in³
Viscosity 4000 cP
4000 cP
Mixed
Linear Mold Shrinkage 0.00300 cm/cm
0.00300 in/in
cure shrinkage
Mechanical Properties Metric English Comments
Hardness, Shore D 92.0
92.0
Flexural Strength 84.8 MPa
12300 psi
Thermal Properties Metric English Comments
CTE, linear 34.2 µm/m-°C
19.0 µin/in-°F
Thermal Conductivity 1.21 W/m-K
8.40 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 185 °C
365 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+16 ohm-cm
1.00e+16 ohm-cm
Dielectric Constant 4.70

@Frequency 1000 Hz
 4.70

@Frequency 1000 Hz
Dielectric Strength 18.9 kV/mm
480 kV/in
Dissipation Factor 0.0100
0.0100
Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 71.1 °C
 2.00 hour

@Temperature 160 °F
 Step 1 of recommended 2 step cure
120 min

@Temperature 149 °C
 2.00 hour

@Temperature 300 °F
 Step 2 of recommended 2 step cure
240 min

@Temperature 104 °C
 4.00 hour

@Temperature 220 °F
 Alternate
Pot Life >= 480 min

@Temperature 25.0 °C
 >= 480 min

@Temperature 77.0 °F
 100 gm mass
Descriptive Properties Value Comments
Chemical Resistance Excellent
Color Black
Mix Ratio 100:25
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