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Aremco Aremco-Bond™ 855 Epoxy Adhesive  (discontinued **)

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aremco Aremco-Bond™ 855 Epoxy Adhesive  (discontinued **).pdf
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Material Notes:
High performance epoxy for specialty bonding and potting applications to 350ºF (175°C). Can be applied to a myriad of substrates, offering exceptional chemical, electrical, and mechanical properties. General purpose, low viscosity, electrical potting compound. Low shrinkage and excellent dimensional stability.
Physical Properties Metric English Comments
Density 1.56 g/cc
0.0564 lb/in³
Viscosity 6000 cP
6000 cP
mix viscosity
Mechanical Properties Metric English Comments
Adhesive Bond Strength 7.00 MPa
1020 psi
Per ASTM D1002-94; shear strength of single lap-joint metal coupons in tension loading.
Thermal Properties Metric English Comments
CTE, linear 39.6 µm/m-°C

@Temperature 20.0 °C
22.0 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.650 W/m-K
4.51 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 180 °C
356 °F
Electrical Properties Metric English Comments
Electrical Resistivity 4.00e+14 ohm-cm
4.00e+14 ohm-cm
Dielectric Constant 4.52

@Frequency 1e+6 Hz
4.52

@Frequency 1e+6 Hz
Dielectric Strength 18.0 kV/mm
457 kV/in
Dissipation Factor 0.010

@Frequency 1e+6 Hz
0.010

@Frequency 1e+6 Hz
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