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Arlon 35N Fast Cure Polyimide Laminate and Prepreg

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Arlon
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon 35N Fast Cure Polyimide Laminate and Prepreg.pdf
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Material Notes:
High reliability and high temperature material35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachmentElectrical and mechanical properties meeting the requirements of IPC-4101/40 and /41Toughened. Non-MDA chemistry resists drill crackingCompatible with lead-free processingRoHS/WEEE compliantTypical Applications:PCBs that are subjected to high temperatures during processing, such as lead-free solderingApplications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors.This data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
Physical Properties Metric English Comments
Density 1.60 g/cc
0.0578 lb/in³
ASTM D792 Method A
Water Absorption 0.26 %
0.26 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Tensile Strength 250 MPa
36300 psi
y; IPC TM-650 2.4.18.3
476 MPa
69000 psi
x; IPC TM-650 2.4.18.3
Modulus of Elasticity 26.2 GPa
3800 ksi
y; IPC TM-650 2.4.18.3
29.6 GPa
4300 ksi
x; IPC TM-650 2.4.18.3
Poissons Ratio 0.15
0.15
y; ASTM D3039
0.16
0.16
x; ASTM D3039
Peel Strength 1.05 kN/m
6.00 pli
To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
1.10 kN/m
6.30 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
1.10 kN/m
6.30 pli
To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
Thermal Properties Metric English Comments
CTE, linear 16.0 µm/m-°C
8.89 µin/in-°F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 51.0 µm/m-°C

@Temperature <=250 °C
28.3 µin/in-°F

@Temperature <=482 °F
z (< Tg); IPC TM-650 2.4.24
158 µm/m-°C

@Temperature >=250 °C
87.8 µin/in-°F

@Temperature >=482 °F
z (> Tg); IPC TM-650 2.4.24
Thermal Conductivity 0.200 W/m-K
1.39 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 250 °C
482 °F
TMA; IPC TM-650 2.4.24
Decomposition Temperature 363 °C
685 °F
Onset; IPC TM-650 2.3.41
407 °C
765 °F
5 percent; IPC TM-650 2.3.41
Flammability, UL94 V-1
V-1
Electrical Properties Metric English Comments
Volume Resistivity 1.20e+14 ohm-cm
1.20e+14 ohm-cm
E24/125; IPC TM-650 2.5.17.1
1.60e+14 ohm-cm
1.60e+14 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 3.70e+14 ohm
3.70e+14 ohm
E24/125; IPC TM-650 2.5.17.1
5.00e+14 ohm
5.00e+14 ohm
C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 4.2

@Frequency 1.00e+6 Hz
4.2

@Frequency 1.00e+6 Hz
May vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength 55.1 kV/mm
1400 kV/in
IPC TM-650 2.5.6.2
Dissipation Factor 0.010
0.010
IPC TM-650 2.5.5.3
Arc Resistance 165 sec
165 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
IPC Delamination - T260 (minutes) > 60
IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes) > 60
IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes) 11
IPC TM-650 2.4.24.1
Z-Axis Expansion (%) 1.2
IPC TM-650 2.4.24 (50-260°C)
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