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Arlon 85NT Polyimide Nonwoven Aramid Laminate and Prepreg

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Arlon
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon 85NT Polyimide Nonwoven Aramid Laminate and Prepreg.pdf
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Material Notes:
85NT is a pure polyimide laminate and prepreg system (Tg = 250°C), reinforced with a non-woven aramid substrate. This system combines the high-reliability features of polyimide (improved PTH reliability and temperature stability) with the low in-plane () expansion and outstanding dimensional stability of a non-woven aramid reinforcement.Low in-plane expansion of 6-9 ppm/°C allows attachment of SMT devices with minimal risk of solder failure joint failure due to CTE mismatchNonwoven aramid reinforcement provides outstanding dimensional stability and enhanced registration for improved multilayer yieldsHigh Decomposition temperature offering outstanding high-temperature lifetime performancePolymeric reinforcement results in PCBs typically 25% lighter in weight than conventional glass-reinforced laminatesLaser and plasma ablatable for high speed formations of microvias and other features as small as 25 micronsElectrical and mechanical properties meeting the requirements of IPC-4101/53Compatible with lead-free solderingRoHS/WEEE compliantTypical Applications:Military and commercial avionics, missiles and missile defense, satellites, and other high-reliability SMT applications requiring both low in-plane () CTE valuesPCBs that are subjected to high temperatures during processing, such as lead-free solderingApplications with significant lifetimes at elevated temperatures, such as aircraft engine instrumentations, on-engine applications, or industrial sensorsThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
Physical Properties Metric English Comments
Density 1.37 g/cc
0.0495 lb/in³
ASTM D792 Method A
Water Absorption 0.60 %
0.60 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Tensile Strength 44.8 MPa
6500 psi
IPC TM-650 2.4.18.3
Modulus of Elasticity 15.9 GPa
2300 ksi
IPC TM-650 2.4.18.3
Flexural Strength 234 MPa
34000 psi
IPC TM-650 2.4.4
Peel Strength 0.684 kN/m
3.90 pli
To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
0.754 kN/m
4.30 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
0.754 kN/m
4.30 pli
To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
Thermal Properties Metric English Comments
CTE, linear 6.00 - 9.00 µm/m-°C
3.33 - 5.00 µin/in-°F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 93.0 µm/m-°C
51.7 µin/in-°F
z, below Tg; IPC TM-650 2.4.24
279 µm/m-°C
155 µin/in-°F
z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity 0.200 W/m-K
1.39 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 250 °C
482 °F
TMA; IPC TM-650 2.4.24
Decomposition Temperature 393 °C
739 °F
Initial; IPC TM-650 2.3.41
426 °C
799 °F
5 percent; IPC TM-650 2.3.41
Electrical Properties Metric English Comments
Volume Resistivity 1.40e+14 ohm-cm
1.40e+14 ohm-cm
E24/125; IPC TM-650 2.5.17.1
2.00e+14 ohm-cm
2.00e+14 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 9.00e+13 ohm
9.00e+13 ohm
E24/125; IPC TM-650 2.5.17.1
6.00e+14 ohm
6.00e+14 ohm
C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 3.6

@Frequency 1.00e+6 Hz
3.6

@Frequency 1.00e+6 Hz
may vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength 39.4 kV/mm
1000 kV/in
IPC TM-650 2.5.6.2
Dissipation Factor 0.014

@Frequency 1.00e+6 Hz
0.014

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
Arc Resistance 160 sec
160 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
IPC Delamination - T260 (minutes) >60
IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes) >60
IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes) >60
IPC TM-650 2.4.24.1
Z-Axis Expansion (%) 2.3
IPC TM-650 2.4.24 (50-260°C)
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