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Armstrong C-1/H20 Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Armstrong Epoxy Adhesives; Resin Technology Group
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Armstrong C-1/H20 Epoxy Adhesive.pdf
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Material Notes:
A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInformation provided by Ellsworth Adhesives.
Physical Properties Metric English Comments
Viscosity 2200 cP
2200 cP
Mixed
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Strength, Ultimate 53.1 MPa
7700 psi
after optimum cure
Elongation at Break 4.8 %
4.8 %
Adhesive Bond Strength 43.4 MPa
6300 psi
Steel-Steel; after optimum cure
7.58 MPa

@Temperature 82.2 °C
1100 psi

@Temperature 180 °F
Aluminum-Aluminum tensile shear
16.2 MPa

@Temperature 25.0 °C
2350 psi

@Temperature 77.0 °F
Aluminum-Aluminum tensile shear
16.9 MPa

@Temperature -54.4 °C
2450 psi

@Temperature -66.0 °F
Aluminum-Aluminum tensile shear
Thermal Properties Metric English Comments
CTE, linear 36.0 µm/m-°C

@Temperature 20.0 °C
20.0 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 79.0 °C
174 °F
Processing Properties Metric English Comments
Processing Temperature 22.2 °C
72.0 °F
73.9 °C
165 °F
Optimum cure is 2 hr. @ 165°F
149 °C
300 °F
Fast cure is 30 min. @ 300°F
Pot Life <= 40.0 min

@Temperature 25.0 °C
<= 40.0 min

@Temperature 77.0 °F
100 g
Descriptive Properties Value Comments
Color Amber
Mix Ratio 3/1
By Weight
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