Atom Adhesives AA-BOND G298 Epoxy Adhesive

AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark BrownCure Type: Heat cure or Room temperature Benefits: Gold filled epoxy allows for antioxidation of contacts and terminals in high reliability devices.It can be used in medical circuits using traditional hybrid packaging technologies.High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes. Mix Ratio by weight: 100:13.5/Resin:Hardener Substrates: Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics Typical Application:Adhesive for joining die and SMDs onto the hybrid circuits.Repairing defective Au thick-film conductor traces and contact pads.Resisting oxidation and electromigration in high-reliability microelectronics.Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C.Information provided by Atom Adhesives