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Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Atom Adhesives
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive.pdf
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Material Notes:
AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. AA-SUPERTHERM 195 bonds readily to itself and to metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured AA-SUPERTHERM 195 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol. This adhesive complies with the requirements of NASA Outgassing Specification when tested according to ASTM E-595-90. Appearance: WhiteCure Type: Heat cure or Room TemperatureBenefits:StrongDurableHigh-impact bondsFullycuredExcellent resistance to many chemicals Mix Ratio by weight: 100:15/Resin:HardenerSubstrates: metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials Typical Application: Extremely sensitive thermal cooling applicationsInformation provided by Atom Adhesives
Physical Properties Metric English Comments
Specific Gravity 1.30 g/cc
1.30 g/cc
mixed, uncured
Solids Content 100 %
100 %
uncured
Viscosity 5000 cP
5000 cP
uncured
Outgassing - Total Mass Loss 0.020 %

@Temperature 65.0 °C,
Time 10800 sec
0.020 %

@Temperature 149 °F,
Time 3.00 hour
NASA, CVCM
0.60 %

@Temperature 65.0 °C,
Time 10800 sec
0.60 %

@Temperature 149 °F,
Time 3.00 hour
NASA, TWL
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Adhesive Bond Strength 11.7 MPa
1700 psi
Thermal Properties Metric English Comments
CTE, linear 40.0 µm/m-°C
22.2 µin/in-°F
Thermal Conductivity 2.00 W/m-K
13.9 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 275 °C
527 °F
Continuous
375 °C
707 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg 54.0 °C
129 °F
Processing Properties Metric English Comments
Cure Time 120 - 240 min

@Temperature 65.0 °C
2.00 - 4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 60.0 min
60.0 min
uncured
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