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Bulk Molding Compounds BMC 901 Encapsulating Grade Molding Compound

Category Polymer , Thermoset , Polyester, TS , Thermoset Polyester Glass and Mineral Filled BMC
Manufacturer BMC - Bulk Molding Compounds Inc.
Trade Name BMC
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Bulk Molding Compounds BMC 901 Encapsulating Grade Molding Compound.pdf
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Material Notes:
BMC 901 is an encapsulation grade, soft flow material. As with all other BMCI compounds, this series can be supplied in logs, slugs or bulk.Typical applications are electrical coil encapsulations and armature shafts.
Physical Properties Metric English Comments
Specific Gravity 1.87 - 1.95 g/cc
1.87 - 1.95 g/cc
Water Absorption 0.10 - 0.20 %
0.10 - 0.20 %
24 hours, 23°C
Linear Mold Shrinkage 0.0014 - 0.0020 cm/cm
0.0014 - 0.0020 in/in
Mechanical Properties Metric English Comments
Hardness, Barcol 35 - 45
35 - 45
Tensile Strength, Ultimate 34.5 - 41.4 MPa
5000 - 6000 psi
Flexural Strength 68.9 - 82.7 MPa
10000 - 12000 psi
Flexural Modulus 9.65 - 13.1 GPa
1400 - 1900 ksi
Compressive Strength 124 - 138 MPa
18000 - 20000 psi
Izod Impact, Notched 1.07 - 2.14 J/cm
2.00 - 4.00 ft-lb/in
Thermal Properties Metric English Comments
Deflection Temperature at 1.8 MPa (264 psi) >= 204 °C
>= 400 °F
Flammability, UL94 HB

@Thickness 1.59 mm
HB

@Thickness 0.0625 in
Electrical Properties Metric English Comments
Dielectric Strength 13.8 kV/mm
350 kV/in
Short Time
Arc Resistance >= 180 sec
>= 180 sec
Comparative Tracking Index >= 500 V
>= 500 V
Processing Properties Metric English Comments
Mold Temperature 138 - 166 °C
280 - 330 °F
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