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CP-Polymer-Technik Wellamid® 6600/42 HWCP Nylon 66, Polymer Modified, Heat Stabilized, Dry

Category Polymer , Thermoplastic , Nylon , Nylon 66 , Nylon 66, Impact Grade
Manufacturer CP-Polymer-Technik GmbH & Co.
Trade Name Wellamid®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF CP-Polymer-Technik Wellamid® 6600/42 HWCP Nylon 66, Polymer Modified, Heat Stabilized, Dry.pdf
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Material Notes:
Information provided by CP-Polymer-Technik GmbH & Co. KG
Physical Properties Metric English Comments
Density 1.11 g/cc
0.0401 lb/in³
ISO 1183
Moisture Absorption at Equilibrium 2.5 - 3.0 %
2.5 - 3.0 %
23°C/50%RH; DIN 53495
Linear Mold Shrinkage 0.0080 - 0.012 cm/cm

@Thickness 4.00 mm
0.0080 - 0.012 in/in

@Thickness 0.157 in
Mechanical Properties Metric English Comments
Tensile Strength, Yield 70.0 MPa
10200 psi
50 mm/min; ISO 527
Elongation at Break 25 %
25 %
50 mm/min; ISO 527
Elongation at Yield 6.0 %
6.0 %
50 mm/min; ISO 527
Tensile Modulus 2.50 GPa
363 ksi
ISO 527
Flexural Modulus 2.10 GPa
305 ksi
DIN 52457
Charpy Impact Unnotched NB

@Temperature 23.0 °C
NB

@Temperature 73.4 °F
ISO 179
Charpy Impact, Notched 1.00 J/cm²

@Temperature 23.0 °C
4.76 ft-lb/in²

@Temperature 73.4 °F
ISO 179
Thermal Properties Metric English Comments
CTE, linear 90.0 µm/m-°C

@Temperature 23.0 - 80.0 °C
50.0 µin/in-°F

@Temperature 73.4 - 176 °F
DIN 53752
Melting Point 255 °C
491 °F
Kofler
Deflection Temperature at 0.46 MPa (66 psi) 150 °C
302 °F
ISO 179
Deflection Temperature at 1.8 MPa (264 psi) 65.0 °C
149 °F
ISO 179
Vicat Softening Point 200 °C
392 °F
50 N; ISO 306
Flammability, UL94 HB

@Thickness 1.60 mm
HB

@Thickness 0.0630 in
Stufe; IEC 707
HB

@Thickness 3.20 mm
HB

@Thickness 0.126 in
Stufe; IEC 707
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm
1.00e+15 ohm-cm
IEC 93
Surface Resistance 1.00e+13 ohm
1.00e+13 ohm
ISO 3915
Dielectric Constant 3.4

@Frequency 1e+6 Hz
3.4

@Frequency 1e+6 Hz
IEC 250
Dielectric Strength 30.0 kV/mm
762 kV/in
IEC 243-1
Dielectric Loss Index 0.015
0.015
At 1 MHz; IEC 250
Comparative Tracking Index 600 V
600 V
Stufe; IEC 112
Processing Properties Metric English Comments
Melt Temperature 260 - 280 °C
500 - 536 °F
Mold Temperature 50.0 - 90.0 °C
122 - 194 °F
Descriptive Properties Value Comments
Back Pressure Low
Holding Pressure High
Injection Speed Medium to High
Screw Speed Medium
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