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Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Filled/Reinforced Thermoset
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A semiconductor grade encapsulant suitable for a wide range of applications ranging from small SOICs to moderate lead count DIPs.
Physical Properties Metric English Comments
Density 1.85 g/cc
0.0668 lb/in³
Spiral Flow 64.0 - 88.0 cm
25.2 - 34.6 in
177°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 73
73
Tensile Strength, Ultimate 107 MPa
15500 psi
Flexural Strength 139 MPa
20200 psi
Thermal Properties Metric English Comments
CTE, linear 21.0 µm/m-°C

@Temperature 20.0 °C
11.7 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 69.0 µm/m-°C

@Temperature 20.0 °C
38.3 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 155 °C
311 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Dielectric Constant 4.0

@Frequency 1000 Hz
4.0

@Frequency 1000 Hz
Dielectric Strength 17.0 kV/mm
432 kV/in
Dissipation Factor 0.0040

@Frequency 1000 Hz
0.0040

@Frequency 1000 Hz
Arc Resistance 180 sec
180 sec
Processing Properties Metric English Comments
Processing Temperature 171 - 193 °C
340 - 379 °F
Molding temperature
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