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Cookson Group Plaskon® 3400 Epoxy Molding Compound  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® 3400 Epoxy Molding Compound  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, QFPs, and SOICs. Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Outstanding device reliability
Physical Properties Metric English Comments
Density 1.82 g/cc
0.0658 lb/in³
Viscosity 8000 - 16000 cP

@Temperature 175 °C
8000 - 16000 cP

@Temperature 347 °F
Automatic orifice Viscosity
Spiral Flow 63.0 - 87.0 cm
24.8 - 34.3 in
177°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 70
70
Flexural Strength 124 MPa
18000 psi
Flexural Modulus 15.0 GPa
2180 ksi
Thermal Properties Metric English Comments
CTE, linear 20.0 µm/m-°C

@Temperature 20.0 °C
11.1 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 62.0 µm/m-°C

@Temperature 20.0 °C
34.4 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 155 °C
311 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm
406 kV/in
Dissipation Factor 0.0020

@Frequency 1000 Hz
0.0020

@Frequency 1000 Hz
Arc Resistance 180 sec
180 sec
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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