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Cookson Group Plaskon® 3400FP Epoxy Molding Compound  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® 3400FP Epoxy Molding Compound  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. Fast cycle times; Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Minimal mold cleaning frequency
Physical Properties Metric English Comments
Density 1.80 g/cc
0.0650 lb/in³
Viscosity 14000 cP

@Temperature 175 °C
14000 cP

@Temperature 347 °F
Automatic orifice Viscosity
Spiral Flow 59.0 - 83.0 cm
23.2 - 32.7 in
177°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 70
70
Flexural Strength 124 MPa
18000 psi
Flexural Modulus 15.0 GPa
2180 ksi
Thermal Properties Metric English Comments
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
12.2 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 60.0 µm/m-°C

@Temperature 20.0 °C
33.3 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 150 °C
302 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Dielectric Constant 3.6

@Frequency 1000 Hz
3.6

@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm
406 kV/in
Dissipation Factor 0.0030

@Frequency 1000 Hz
0.0030

@Frequency 1000 Hz
Arc Resistance 180 sec
180 sec
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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