Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy, Molded, Mineral Filled , Filled/Reinforced Thermoset
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate a variety of semiconductor devices including diodes, transistors, and other semiconductor devices requiring high power and thermal dissipation.

Physical Properties	Metric	English	Comments
Density	2.05 g/cc	0.0741 lb/in³
Spiral Flow	64.0 - 88.0 cm	25.2 - 34.6 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	85	85
Tensile Strength, Ultimate	97.0 MPa	14100 psi
Flexural Strength	138 MPa	20000 psi

Thermal Properties	Metric	English
CTE, linear	30.0 µm/m-°C @Temperature 20.0 °C	16.7 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	80.0 µm/m-°C @Temperature 20.0 °C	44.4 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	165 °C	329 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	3.9 @Frequency 1000 Hz	3.9 @Frequency 1000 Hz
Dielectric Strength	20.0 kV/mm	508 kV/in
Dissipation Factor	0.0060 @Frequency 1000 Hz	0.0060 @Frequency 1000 Hz
Arc Resistance	190 sec	190 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

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