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Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Cytec
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener.pdf
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Material Notes:
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® HardenerA filled, high performance flexible epoxy casting system. Little change in hardness after aging at 155°C. Recommended for potting and encapsulating transformers, coils and similar electrical devices.Mix Ratio, Resin/Hardener (by weight): 100/25 Cure Type: Elevated Temperature
Physical Properties Metric English Comments
Viscosity 11000 cP

@Temperature 25.0 °C
11000 cP

@Temperature 77.0 °F
Mechanical Properties Metric English Comments
Hardness, Shore D 82
82
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 155 °C
311 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 2.10e+14 ohm-cm
<= 2.10e+14 ohm-cm
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Dielectric Strength 15.0 kV/mm
380 kV/in
Dissipation Factor 0.012

@Frequency 1000 Hz
0.012

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 140 °C
2.00 hour

@Temperature 284 °F
Pot Life 180 min

@Temperature 120 °C
180 min

@Temperature 248 °F
100 grams
480 min

@Temperature 25.0 °C
480 min

@Temperature 77.0 °F
100 grams
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