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DSM Somos® 7110 Epoxy Photopolymer, UV Postcure  (discontinued **)

Category Polymer , Rapid Prototyping Polymer , Thermoset , Epoxy
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF DSM Somos® 7110 Epoxy Photopolymer, UV Postcure  (discontinued **).pdf
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Material Notes:
DescriptionDSM Somos® 7110 Photopolymer is a humidity-tolerant, high heat-deflection-temperature, low-curl, high-speed liquid that produces rigid, highly accurate parts. It produces exceptional, undistorted thin walls and down-facing surfaces and exhibits good processing latitude.ApplicationSomos® 7110 Photopolymer is used in the solid imaging process to build three-dimensional parts.Information Provided by DSM Desotech Inc.
Physical Properties Metric English Comments
Density 1.13 g/cc

@Temperature 25.0 °C
0.0408 lb/in³

@Temperature 77.0 °F
Viscosity 700 cP

@Temperature 30.0 °C
700 cP

@Temperature 86.0 °F
Mechanical Properties Metric English Comments
Hardness, Shore D 82
82
ASTM D2240
Tensile Strength, Yield 56.0 MPa
8120 psi
ASTM D638M
Elongation at Break 5.4 - 7.1 %
5.4 - 7.1 %
ASTM D638M
Modulus of Elasticity 2.117 GPa
307.0 ksi
ASTM D638M
Flexural Strength 85.0 MPa
12300 psi
ASTM D790M
Flexural Modulus 2.423 GPa
351.4 ksi
ASTM D790M
Izod Impact, Notched 0.278 J/cm
0.521 ft-lb/in
ASTM D256A
Thermal Properties Metric English Comments
Deflection Temperature at 0.46 MPa (66 psi) 59.0 - 72.0 °C
138 - 162 °F
ASTM D648
Descriptive Properties Value Comments
Appearance Transparent Amber
Dp (mm) 0.14
Slope of cure-depth vs. ln(E) curve
E10 (mJ/cm2) 51
Exposure that gives 0.254mm thickness
E5 (mJ/cm2) 20
Exposure that gives 0.127mm thickness
Ec (mJ/cm2) 8.2
Critical exposure
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