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E-Polymers SEPAZ® C245GP 45% Glass Fiber Reinforced LCP Resin

Category Polymer , Thermoplastic , Liquid Crystal Polymer (LCP) , Liquid Crystal Polymer (LCP), 50% Glass Fiber Filled
Manufacturer E-Polymers Co. Ltd.
Trade Name SEPAZ®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF E-Polymers SEPAZ® C245GP 45% Glass Fiber Reinforced LCP Resin.pdf
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Material Notes:
Liquid Crystal Polymer Resin: SEPAZ LCP resin has a unique structure and performance unthought of in a traditional plastics. Beside SEPAZ LCP takes the excels in all-around performance and molding productivity. SEPAZ LCP has a unique attribute in that the thinner the product becomes, the greater the mechanical strength. SEPAZ LCP finds uses in connectors, sensors and other electronic components and CD pick-up parts, and in copying machine and fax components in office and audio-visual equipment.Information Provided by E-Polymers Co., Ltd.
Physical Properties Metric English Comments
Specific Gravity 1.74 g/cc
1.74 g/cc
ASTM D792
Linear Mold Shrinkage 0.00050 cm/cm
0.00050 in/in
Linear Mold Shrinkage, Transverse 0.0050 cm/cm
0.0050 in/in
Mechanical Properties Metric English Comments
Tensile Strength 135.4 MPa
19630 psi
ASTM D638
Elongation at Break 0.90 %
0.90 %
ASTM D638
Flexural Strength 191.3 MPa
27750 psi
ASTM D790
Flexural Modulus 18.34 GPa
2661 ksi
ASTM D790
Izod Impact, Notched 0.588 J/cm
1.10 ft-lb/in
ASTM D256
Thermal Properties Metric English Comments
Melting Point 352 °C
666 °F
ASTM D789
Deflection Temperature at 1.8 MPa (264 psi) 295 °C
563 °F
ASTM D648
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm
1.00e+15 ohm-cm
ASTM D257
Surface Resistance 1.00e+15 ohm
1.00e+15 ohm
ASTM D257
Dielectric Constant 4.3

@Frequency 1.00e+6 Hz
4.3

@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 21.0 kV/mm

@Thickness 1.60 mm
533 kV/in

@Thickness 0.0630 in
ASTM D149
Dissipation Factor 0.025

@Frequency 1.00e+6 Hz
0.025

@Frequency 1.00e+6 Hz
ASTM D150
Processing Properties Metric English Comments
Melt Temperature 360 - 370 °C
680 - 698 °F
Mold Temperature 30.0 - 160 °C
86.0 - 320 °F
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