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Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Application Notes: Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation. Ease of use: potting and casting, encapsulation and adhesive.Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level including wafer level packaging.Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive for bonding optics inside OEM / Scientific instruments.Fiber optic adhesive: bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light.BIOCOMPATIBLE and NON-TOXIC; complies with USP Class VI biocompatibility standards for medical devices and implantation applications.Adhesion to glass, quartz, metals, wood and most plastics is very goodMay also be used for impregnating wooden or porous objects for artifact restorationCapable of cryogenic cooling applications.NASA approved, low outgassing epoxyInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 0.890 g/cc
0.890 g/cc
Part B
1.02 g/cc
1.02 g/cc
Part A
Viscosity 225 - 425 cP

@Temperature 23.0 °C
225 - 425 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Modulus 2.06 GPa
299 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 35.2 MPa
>= 5100 psi
Die
Thermal Properties Metric English Comments
CTE, linear 61.0 µm/m-°C
33.9 µin/in-°F
Below Tg
180 µm/m-°C
100 µin/in-°F
Above Tg
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 360 °C
680 °F
Degradation Temperature
Optical Properties Metric English Comments
Refractive Index 1.5318

@Wavelength 589 nm
1.5318

@Wavelength 589 nm
uncured
Transmission, Visible >= 94 %

@Wavelength 320 nm
>= 94 %

@Wavelength 320 nm
Spectral
>= 98 %

@Wavelength 1200 - 1600 nm
>= 98 %

@Wavelength 1200 - 1600 nm
Spectral
>= 99 %

@Wavelength 400 - 1200 nm
>= 99 %

@Wavelength 400 - 1200 nm
Spectral
Electrical Properties Metric English Comments
Volume Resistivity >= 2.00e+12 ohm-cm
>= 2.00e+12 ohm-cm
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Dissipation Factor 0.012

@Frequency 1000 Hz
0.012

@Frequency 1000 Hz
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 104 ppm
104 ppm
Ionic Impurities - Cl (Chloride) 61 ppm
61 ppm
Processing Properties Metric English Comments
Cure Time 180 min

@Temperature 80.0 °C
3.00 hour

@Temperature 176 °F
2880 min

@Temperature 23.0 °C
48.0 hour

@Temperature 73.4 °F
Pot Life 4800 min
4800 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Clear/Colorless
Part A
Clear/Colorless
Part B
Consistency Pourable liquid
Mix Ratio By Weight 100:35
Number of Components Two
Weight Loss 0.01%
200°C
0.46%
250°C
2.19%
300°C
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