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Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.Advantages & Application Notes: Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation.Ease of use: potting and casting, encapsulation, and adhesive.Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level.Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive for bonding optics inside OEM / scientific instruments.Fiber optic adhesive; bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light.BIOCOMPATIBLE and NON-TOXIC; complies with USP Class VI biocompatibility standards for medical devices and implantation applications.Adhesion to glass, quartz, metals, wood and most plastics is very good.May also be used for impregnating wooden or porous objects for artifact restoration.Capable of both heat cure and room temperature cure.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 0.890 g/cc
0.890 g/cc
Part B
1.06 g/cc
1.06 g/cc
Part A
Viscosity 100 - 200 cP

@Temperature 23.0 °C
100 - 200 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 70
70
Tensile Modulus 1.05 GPa
153 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 56.0 µm/m-°C
31.1 µin/in-°F
Below Tg
211 µm/m-°C
117 µin/in-°F
Above Tg
Maximum Service Temperature, Air 150 °C
302 °F
Continuous
250 °C
482 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 45.0 °C
>= 113 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 325 °C
617 °F
Degradation Temperature
Optical Properties Metric English Comments
Refractive Index 1.5115

@Wavelength 589 nm
1.5115

@Wavelength 589 nm
uncured
Transmission, Visible >= 97 %

@Wavelength 1000 - 1600 nm
>= 97 %

@Wavelength 1000 - 1600 nm
Spectral
>= 99 %

@Wavelength 400 - 1000 nm
>= 99 %

@Wavelength 400 - 1000 nm
Spectral
Electrical Properties Metric English Comments
Volume Resistivity >= 6.00e+11 ohm-cm
>= 6.00e+11 ohm-cm
Dielectric Constant 3.54

@Frequency 1000 Hz
3.54

@Frequency 1000 Hz
Dissipation Factor 0.013

@Frequency 1000 Hz
0.013

@Frequency 1000 Hz
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 58 ppm
58 ppm
Ionic Impurities - K (Potassium) 19 ppm
19 ppm
Ionic Impurities - Cl (Chloride) 105 ppm
105 ppm
Processing Properties Metric English Comments
Cure Time 180 min

@Temperature 80.0 °C
3.00 hour

@Temperature 176 °F
4320 min

@Temperature 23.0 °C
72.0 hour

@Temperature 73.4 °F
Pot Life 600 min
600 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Clear/Colorless
Part A
Clear/Colorless
Part B
Consistency Pourable liquid
Ionic Impurities NH4 8 ppm
Mix Ratio By Weight 100:35
Number of Components Two
Weight Loss 0.5%
200°C
0.96%
250°C
3.52%
300°C
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