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Epoxy Technology EPO-TEK® 301 Spectrally Transparent Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 301 Spectrally Transparent Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.Advantages & Application Notes: Semiconductor: optical glob top or underfill; adhesion to common wafer passivation, solder mask and flex circuits; compatible with LED die, Si, GaAs.PCB: general potting and protection over FR4, flex, or ceramic PCBs. Medical:It is NONTOXIC—complying with USP Class VI Biocompatibility standards. Suggested for medical devices such as catheters, hand and tooling, dental, and endoscopic products; adhesion to stainless steel, titanium, and most plastics; resisting sterilizing techniques like ETO, gamma, and autoclave (65°C/1 hour cure); resisting X-ray radiation; potting and protection of scintillator crystals; CT Detector packaging; adhesive for the optical beam pathway in photo-diode arrays.Compatible with CIDEX® OPA sterilization.Fiber Optic: adhesive for glass and plastic fibers; wicking into fiber bundles used in patch cords, endoscopes or sensor devices; adhesive/seal/encapsulant used for fiber packaging and components; transmission of IR up to 2500 nm; terminating fibers into ferrules; fiber coupling and splicing.Opto-electronicLCD/LED adhesive for laminating glass layers; adhesion to PET plastic; general potting, encapsulation, and protection; spectral transmission in VIS and IR light; adhesive/encapsulant for VCSEL’s packaged devices; resisting yellowing per ASTM D1925; adhesive for precision optics including lens, prism, beam splitter cubes, mirrors, and diodes, found in medical, university, or research communities.NASA approved, low outgassing epoxyInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 0.870 g/cc
0.870 g/cc
Part B
1.15 g/cc
1.15 g/cc
Part A
Viscosity 100 - 200 cP

@Temperature 23.0 °C
100 - 200 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Tensile Modulus 2.26 GPa
327 ksi
Storage
Shear Strength >= 2.34 MPa
>= 340 psi
Die
>= 13.8 MPa
>= 2000 psi
Lap
Thermal Properties Metric English Comments
CTE, linear 39.0 µm/m-°C
21.7 µin/in-°F
Below Tg
98.0 µm/m-°C
54.4 µin/in-°F
Above Tg
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 65.0 °C
>= 149 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 430 °C
806 °F
Degradation Temperature
Optical Properties Metric English Comments
Refractive Index 1.519

@Wavelength 589 nm
1.519

@Wavelength 589 nm
uncured
Transmission, Visible >= 95 %

@Wavelength 1640 - 2040 nm
>= 95 %

@Wavelength 1640 - 2040 nm
Spectral
>= 97 %

@Wavelength 980 - 1640 nm
>= 97 %

@Wavelength 980 - 1640 nm
Spectral
>= 99 %

@Wavelength 380 - 980 nm
>= 99 %

@Wavelength 380 - 980 nm
Spectral
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+13 ohm-cm
>= 1.00e+13 ohm-cm
Dielectric Constant 4.0

@Frequency 1000 Hz
4.0

@Frequency 1000 Hz
Dissipation Factor 0.016

@Frequency 1000 Hz
0.016

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 65.0 °C
1.00 hour

@Temperature 149 °F
120 min

@Temperature 65.0 °C
2.00 hour

@Temperature 149 °F
1440 min

@Temperature 23.0 °C
24.0 hour

@Temperature 73.4 °F
Pot Life 60 - 120 min
60 - 120 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Clear/Colorless
Part A
Clear/Colorless
Part B
Consistency Pourable liquid
Mix Ratio By Weight 20:5
Number of Components Two
Weight Loss 0.12%
200°C
0.13%
250°C
0.39%
300°C
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