Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This product is a color-coded, black and opaque version of the industry standard EPO-TEK® 353ND-T epoxy adhesive.Suggested applications:Semiconductor, glob top DAM around IC’s, using COB or DCA packaging formatsElectronics AssemblyInsulating adhesive for bonding stainless steel metals, ceramics and carbon composites used in ink-jetting headsInsulating and plugging wires and feed-through cables of automotive circuitsHard Disk Drive – thixotropic staking and termination of Al and Cu coilsAdhesive for brushless motors and Cu coil windingsMedicalLight blocking in endoscopes, camera optics and IR sensor devicesOpticalFiber optic component packaging: bonding fibers, active optics, metals, ceramics and plasticAvailable in alternative viscosities and colorInformation Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.02 g/cc	1.02 g/cc	Part B
	1.12 g/cc	1.12 g/cc	Part A
Particle Size	<= 20 µm	<= 20 µm
Viscosity	9000 - 15000 cP @Temperature 23.0 °C	9000 - 15000 cP @Temperature 73.4 °F	20 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Tensile Modulus	3.8550 GPa	559.12 ksi	Storage
Shear Strength	>= 13.8 MPa	>= 2000 psi	Lap
	>= 35.2 MPa	>= 5100 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	43.0 µm/m-°C	23.9 µin/in-°F	Below Tg
	231 µm/m-°C	128 µin/in-°F	Above Tg
Maximum Service Temperature, Air	225 °C	437 °F	Continuous
	325 °C	617 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	409 °C	768 °F	Degradation Temperature

Optical Properties	Metric	English	Comments
Transmission, Visible	<= 5.0 % @Wavelength 300 - 1460 nm	<= 5.0 % @Wavelength 300 - 1460 nm	Spectral
	<= 7.0 % @Wavelength 1550 nm	<= 7.0 % @Wavelength 1550 nm	Spectral

Electrical Properties	Metric	English
Volume Resistivity	>= 4.00e+12 ohm-cm	>= 4.00e+12 ohm-cm
Dielectric Constant	3.21 @Frequency 1000 Hz	3.21 @Frequency 1000 Hz
Dissipation Factor	0.0030 @Frequency 1000 Hz	0.0030 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	1.00 min @Temperature 150 °C	0.0167 hour @Temperature 302 °F	Minimum Bond Line
	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	Minimum Bond Line
	10.0 min @Temperature 100 °C	0.167 hour @Temperature 212 °F	Minimum Bond Line
	30.0 min @Temperature 80.0 °C	0.500 hour @Temperature 176 °F	Minimum Bond Line
Pot Life	180 min	180 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Black	Part A
Consistency	Smooth, thixotropic paste
Mix Ratio By Weight	10:1
Number of Components	Two
Thixotropic Index	3.8
Weight Loss	0.53%	200°C
	1.22%	250°C
	2.37%	300°C

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