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Epoxy Technology EPO-TEK® 375 High Temperature Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 375 High Temperature Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen syringe.Advantages & Application Notes: Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices and resisting high temperature packaging.Down-hole petrochemical fiber optic sensors resisting >200°C field conditions.Fiber optic adhesive suggested applications:Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range.Fiber component packaging, adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.Medical suggested applications:Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including stainless steel, diamond, titanium, brass, ceramics, glass and most plastics.Certified to USP Class VI Biocompatibility Standards for medical implants; adhesive for catheter devices including stents and guide wires.Electronics Assembly suggested applications:Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.Structural grade epoxy found in hard-disk drive devices; bonding of stainless steel metals, kapton, and magnets.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.00 g/cc
1.00 g/cc
Part B
1.20 g/cc
1.20 g/cc
Part A
Viscosity 3000 - 5000 cP

@Temperature 23.0 °C
3000 - 5000 cP

@Temperature 73.4 °F
50 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 88
88
Tensile Modulus 2.34 GPa
339 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 48.0 µm/m-°C
26.7 µin/in-°F
Below Tg
192 µm/m-°C
107 µin/in-°F
Above Tg
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 421 °C
790 °F
Degradation Temperature
Optical Properties Metric English Comments
Refractive Index 1.5692

@Wavelength 589 nm
1.5692

@Wavelength 589 nm
Transmission, Visible >= 94 %

@Wavelength 600 - 790 nm
>= 94 %

@Wavelength 600 - 790 nm
Spectral
>= 98 %

@Wavelength 800 - 1500 nm
>= 98 %

@Wavelength 800 - 1500 nm
Spectral
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+13 ohm-cm
>= 1.00e+13 ohm-cm
Dielectric Constant 3.34

@Frequency 1000 Hz
3.34

@Frequency 1000 Hz
Dissipation Factor 0.0040

@Frequency 1000 Hz
0.0040

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
20.0 min

@Temperature 120 °C
0.333 hour

@Temperature 248 °F
Minimum Bond Line
60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
Minimum Bond Line
90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Minimum Bond Line
Pot Life 240 min
240 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Clear/Colorless
Part A
Consistency Pourable liquid
Mix Ratio By Weight 10:1
Number of Components Two
Weight Loss 0.06%
200°C
0.16%
250°C
0.49%
300°C
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