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Epoxy Technology EPO-TEK® E2036 Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® E2036 Epoxy.pdf
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Material Notes:
Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB level, flex circuitry, or optical and medical devices. It can be used for resisting thermal cycles, high vibration applications or resisting PCB drop tests.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.81 g/cc
2.81 g/cc
Part A
3.52 g/cc
3.52 g/cc
Part B
Particle Size <= 20 µm
<= 20 µm
Viscosity 10000 - 20000 cP

@Temperature 23.0 °C
10000 - 20000 cP

@Temperature 73.4 °F
20 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 75
75
Tensile Modulus 4.40 GPa
638 ksi
Storage
Shear Strength 10.29 MPa
1492 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 39.0 µm/m-°C
21.7 µin/in-°F
Below Tg
178 µm/m-°C
98.9 µin/in-°F
Above Tg
Thermal Conductivity 1.53 W/m-K
10.6 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °C
482 °F
Continuous
350 °C
662 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 30.0 °C
>= 86.0 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 444 °C
831 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity >= 0.00030 ohm-cm
>= 0.00030 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 1.0 ppm
1.0 ppm
Ionic Impurities - K (Potassium) 8.0 ppm
8.0 ppm
Ionic Impurities - Cl (Chloride) 422 ppm
422 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Pot Life 4320 min
4320 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Soft, smooth paste
Ionic Impurities NH4 159 ppm
Mix Ratio By Weight 3:1
Number of Components Two
Thixotropic Index 3.95
Weight Loss 0.13%
200°C
0.32%
250°C
0.65%
300°C
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