Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Advantages & Application Notes: It is a snap cure version of EPO-TEK® H20E, designed for snap cure at 140°C and

Physical Properties	Metric	English	Comments
Specific Gravity	2.51 g/cc	2.51 g/cc	Part B
	3.80 g/cc	3.80 g/cc	Part A
Particle Size	<= 45 µm	<= 45 µm
Viscosity	2361 cP @Temperature 23.0 °C	2361 cP @Temperature 73.4 °F	50 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	55	55
Tensile Modulus	6.39 GPa	928 ksi	Storage
Shear Strength	>= 13.8 MPa	>= 2000 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	56.0 µm/m-°C	31.1 µin/in-°F	Below Tg
	233 µm/m-°C	129 µin/in-°F	Above Tg
Thermal Conductivity	2.63 W/m-K	18.3 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	85.0 °C	185 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	392 °C	738 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00040 ohm-cm	<= 0.00040 ohm-cm

Processing Properties	Metric	English	Comments
Cure Time	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	Minimum Bond Line
	35.0 min @Temperature 140 °C	0.583 hour @Temperature 284 °F	Minimum Bond Line
	45.0 min @Temperature 80.0 °C	0.750 hour @Temperature 176 °F	Minimum Bond Line
Pot Life	1200 min	1200 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Silver	Part A
	Silver	Part B
Consistency	Smooth thixotropic paste
Mix Ratio By Weight	1:1
Number of Components	Two
Thixotropic Index	4.62
Weight Loss	0.73%	200°C
	1.67%	250°C
	2.37%	300°C

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