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Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for non-military low chloride applications. Advantages & Application Notes: Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired. Suggested for JEDEC Level III and II for plastic IC packaging. Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C. Ease of use; apply by dispensing, screen printing, die-stamping, or by hand. Especially suited for high power devices and high current flow. High power LEDs. Opto-electronic packaging material: LED, LCDs, and fiber optic components. Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.42 g/cc
2.42 g/cc
Part A
3.07 g/cc
3.07 g/cc
Part B
Particle Size <= 45 µm
<= 45 µm
Viscosity 2200 - 3200 cP

@Temperature 23.0 °C
2200 - 3200 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 60
60
Tensile Modulus 5.39 GPa
781 ksi
Storage
Shear Strength 11.53 MPa
1672 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 19.0 µm/m-°C
10.6 µin/in-°F
Below Tg
78.0 µm/m-°C
43.3 µin/in-°F
Above Tg
Thermal Conductivity 1.69 W/m-K
11.7 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 451 °C
844 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00040 ohm-cm
<= 0.00040 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 6.0 ppm
6.0 ppm
Ionic Impurities - K (Potassium) 2.0 ppm
2.0 ppm
Ionic Impurities - Cl (Chloride) 11 ppm
11 ppm
Processing Properties Metric English Comments
Cure Time 0.750 min

@Temperature 175 °C
0.0125 hour

@Temperature 347 °F
Minimum Bond Line
5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
Minimum Bond Line
Pot Life 5760 min
5760 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth thixotropic paste
Ionic Impurities NH4 259 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 4.6
Weight Loss 0.42%
200°C
1.03%
250°C
1.96%
300°C
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