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Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy.pdf
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  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.Advantages & Application Notes: Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired. Suggested for JEDEC Level III and II for plastic IC packaging. Capable of resisting TC wire bonding temperatures in the 300°C range. Ease of use: apply by dispensing, screen printing, or by hand.Especially suited for high power devices and high current flow. High power LEDs. Opto-electronic packaging material: LED, LCDs, and fiber optic components. Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.72 g/cc
2.72 g/cc
Part A
4.33 g/cc
4.33 g/cc
Part B
Particle Size <= 45 µm
<= 45 µm
Viscosity 10000 - 20000 cP

@Temperature 23.0 °C
10000 - 20000 cP

@Temperature 73.4 °F
20 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 66
66
Tensile Modulus 5.46 GPa
791 ksi
Storage
Shear Strength 8.384 MPa
1216 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 26.0 µm/m-°C
14.4 µin/in-°F
Below Tg
111 µm/m-°C
61.7 µin/in-°F
Above Tg
Thermal Conductivity 3.50 W/m-K
24.3 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °C
482 °F
Continuous
350 °C
662 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 470 °C
878 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00040 ohm-cm
<= 0.00040 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Cl (Chloride) 141 ppm
141 ppm
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
Minimum Bond Line
90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Minimum Bond Line
Pot Life 4320 min
4320 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Thixotropic paste
Ionic Impurities NH4 265 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 4.85
Weight Loss 0.25%
200°C
0.37%
250°C
0.79%
300°C
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