Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or hybrid micro-electronics.Advantages & Application Notes: Rheology provides a soft, smooth, thixotropic paste. The epoxy can be screen printed or applied by hand or spatula.Ideal for screen printing applications. Designed for use in machine dispensing where dot sizes as small as 8 mils can be readily deposited.Available in lower viscosity versions.Thermal resistance is nearly equivalent to solder die-attach. Suitable for laser diode attach, TE Coolers, and heatsinking in general.Reliability report summarized in Technical Paper #2 from Epoxy Technology Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	2.85 g/cc	2.85 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	40000 - 70000 cP @Temperature 23.0 °C	40000 - 70000 cP @Temperature 73.4 °F	5 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85
Tensile Modulus	6.25 GPa	906 ksi	Storage
Shear Strength	7.943 MPa	1152 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F	Below Tg
	178 µm/m-°C	98.9 µin/in-°F	Above Tg
Thermal Conductivity	3.48 W/m-K	24.2 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Decomposition Temperature	350 °C	662 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	222 ppm	222 ppm
Ionic Impurities - K (Potassium)	36 ppm	36 ppm
Ionic Impurities - Cl (Chloride)	19 ppm	19 ppm

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F	Minimum Bond Line
Pot Life	129600 min	129600 min
Shelf Life	6.00 Month @Temperature -40.0 °C	6.00 Month @Temperature -40.0 °F

Descriptive Properties	Value	Comments
Color	Silver
Consistency	Smooth thixotropic paste
Number of Components	Single
Thixotropic Index	3.9
Weight Loss	0.08%	200°C
	0.18%	250°C
	0.43%	300°C

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