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Epoxy Technology EPO-TEK® H81A Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H81A Epoxy.pdf
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Material Notes:
Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 5.62 g/cc
5.62 g/cc
Part B
5.80 g/cc
5.80 g/cc
Part A
Particle Size <= 50 µm
<= 50 µm
Viscosity 250000 - 300000 cP

@Temperature 23.0 °C
250000 - 300000 cP

@Temperature 73.4 °F
0.5 rpm
Mechanical Properties Metric English Comments
Shear Strength >= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 250 °C
482 °F
Continuous
350 °C
662 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 412 °C
774 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00090 ohm-cm
<= 0.00090 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Minimum
Pot Life 2880 min
2880 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Dark Brown
Part A
Dark Brown
Part B
Consistency Thick paste
Mix Ratio By Weight 6:1
Number of Components Two
Weight Loss <0.5%
200°C
0.07%
250°C
0.16%
300°C
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