Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy

Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing, or hand methods such as toothpick, spatula or pin transfer.Color change upon cure – off-white to amber-brown - allows easy visual inspection.The CTE value below the Tg keeps potential stress to a minimum.Suggested applications:Fiber Optic PackagingSealing fiber into the snout, ferrule, or feed-through of the opto-package.Mounting optics, such as lenses, diodes, prisms, onto the substrate or “optical bench.”Adhesive for building the optical bench to the correct Z-height.“Toughened” adhesive to prevent fiber from the “piston effect”.SemiconductorAs underfill of flip chip devices and SMDs like BGAs, capacitors and resistors.MedicalAs an alternative to EPO-TEK® 353ND for moisture resistance.Capable of short cure cycles at low temperature, such as 80°C.Information Provided by Epoxy Technology