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Hexcel® HexPly® F593 Epoxy Resin

Category Polymer , Thermoset , Epoxy , Epoxy Cure Resin
Manufacturer Hexcel
Trade Name HexPly®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® HexPly® F593 Epoxy Resin.pdf
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Material Notes:
HexPly® F593 is a modified 350°F (177°C) curing epoxy system with very low flow for carbon fabric and tape applications that provides excellent laminate and honeycomb sandwich properties. As a low flow resin, HexPly® F593 lends itself to net resin, zero bleed applications. HexPly® F593's adhesive properties allow for the elimination of adhesive layers in co-curing sandwich structures. HexPly® F593 low flow minimizes sandwich part porosity.Information provided by HexCel
Physical Properties Metric English Comments
Specific Gravity 1.22 g/cc
1.22 g/cc
Volatiles 3.92 %
3.92 %
After 30 min at 177ºC
Moisture Absorption at Equilibrium 4.2 %
4.2 %
Mechanical Properties Metric English Comments
Tensile Strength, Yield 60.4 MPa
8760 psi
Elongation at Yield 2.0 %
2.0 %
Tensile Modulus 2.96 GPa
429 ksi
Poissons Ratio 0.35
0.35
Fracture Toughness 1.22 MPa-m½
1.11 ksi-in½
Shear Modulus 1.10 GPa
160 ksi
Calculated
Thermal Properties Metric English Comments
CTE, linear 54.0 µm/m-°C
30.0 µin/in-°F
Glass Transition Temp, Tg 131 °C
268 °F
Wet
172 °C
342 °F
Dry
Processing Properties Metric English Comments
Gel Time 9.00 - 17.0 min

@Temperature 177 °C
9.00 - 17.0 min

@Temperature 351 °F
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