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- Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant
Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant
| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | Lord Adhesives |
| Trade Name | Thermoset™ |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications and minimize the chances of ion-induced corrosion in these devices.Thermoset ME-455 encapsulant offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces. It can be used in demanding high-end, consumer and automotive applications.All information provided by Lord.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.69 g/cc | 1.69 g/cc | |
| Brookfield Viscosity | 14000 - 24000 cP | 14000 - 24000 cP | Spindle 14 @ 10rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 91 - 98 | 91 - 98 | |
| Modulus of Elasticity | 6.00 GPa | 870 ksi | DMA |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Alpha 1; TMA |
| 60.0 µm/m-°C | 33.3 µin/in-°F | Alpha 2; TMA | |
| Glass Transition Temp, Tg | 135 °C | 275 °F | TMA |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Potassium, K | 0.00010 % | 0.00010 % | |
| Sodium, Na | 0.00050 % | 0.00050 % |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+15 ohm-cm @Temperature 25.0 °C |
1.00e+15 ohm-cm @Temperature 77.0 °F |
|
| Dielectric Constant | 3.5 @Frequency 1.00e+6 Hz |
3.5 @Frequency 1.00e+6 Hz |
|
| Dissipation Factor | 0.0080 @Frequency 1.00e+6 Hz |
0.0080 @Frequency 1.00e+6 Hz |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Pot Life | 2160 min @Temperature 25.0 °C |
2160 min @Temperature 77.0 °F |
|
| Gel Time | 3.00 - 5.00 min @Temperature 150 °C |
3.00 - 5.00 min @Temperature 302 °F |
|
| Shelf Life | 6.00 Month @Temperature -40.0 °C |
6.00 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Appearance | Black | |
| Chloride (%) | 0.0005 | |
| Consistency | Paste |
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