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Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound

Category Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer Lord Adhesives
Trade Name Thermoset™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound.pdf
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Material Notes:
Lord UR-329 is a flexible, two-component, room temperature curing, urethane, encapsulating compound. UR-329 maintains low hardness and modulus over a wide temperature range, which imparts minimal stress on delicate electronic components. UR-329 is a filled system, which enhances its ability to dissipate heat. It is often suitable in applications operating up to 130°C. UR-329 also exhibits excellent thermal shock resistance, very good electrical properties and good adhesion to a variety of materials.All information provided by Lord.
Physical Properties Metric English Comments
Water Absorption 0.16 %

@Temperature 25.0 °C,
Time 86400 sec
0.16 %

@Temperature 77.0 °F,
Time 24.0 hour
ASTM D570
Loss On Ignition <= 0.10 %

@Temperature 125 °C,
Time 605000 sec
<= 0.10 %

@Temperature 257 °F,
Time 168 hour
Viscosity 60 cP

@Temperature 25.0 °C
60 cP

@Temperature 77.0 °F
Hardener; STM 1
4400 cP

@Temperature 25.0 °C
4400 cP

@Temperature 77.0 °F
Mixed; STM 1
11000 cP

@Temperature 25.0 °C
11000 cP

@Temperature 77.0 °F
Resin; STM 1
Mechanical Properties Metric English Comments
Hardness, Shore A 25 - 30
25 - 30
ASTM D2240
Thermal Properties Metric English Comments
CTE, linear 191.7 µm/m-°C
106.5 µin/in-°F
ASTM D3386
Thermal Conductivity 0.300 W/m-K
2.08 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 130 °C
266 °F
Glass Transition Temp, Tg -68.0 °C
-90.4 °F
ASTM D3386
Electrical Properties Metric English Comments
Volume Resistivity 1.06e+15 ohm-cm
1.06e+15 ohm-cm
ASTM D257
Dielectric Constant 4.4

@Frequency 1.00e+6 Hz,
Temperature 25.0 °C
4.4

@Frequency 1.00e+6 Hz,
Temperature 77.0 °F
ASTM D150
Dielectric Strength >= 19.7 kV/mm
>= 500 kV/in
ASTM D149
Dissipation Factor 0.0448

@Frequency 1.00e+6 Hz,
Temperature 25.0 °C
0.0448

@Frequency 1.00e+6 Hz,
Temperature 77.0 °F
ASTM D150
Processing Properties Metric English Comments
Cure Time 180 - 240 min

@Temperature 66.0 °C
3.00 - 4.00 hour

@Temperature 151 °F
Full
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Initial
4320 - 5760 min

@Temperature 25.0 °C
72.0 - 96.0 hour

@Temperature 77.0 °F
Full
Pot Life 60 - 90 min

@Temperature 25.0 °C
60 - 90 min

@Temperature 77.0 °F
Gel Time 60.0 min

@Temperature 66.0 °C
60.0 min

@Temperature 151 °F
Shelf Life 6.00 Month

@Temperature 25.0 °C
6.00 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Appearance Amber (w/fluorescent yellow die)
Hardener
Black
Mixed
Black
Resin
Mix Ratio 100:15
by weight
5:1
by volume
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