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Master Bond EP21ND Non Drip Room Temperature Curing Epoxy System

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21ND Non Drip Room Temperature Curing Epoxy System.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties. EP21ND can be mixed by weight or volume and is available in a special non drip formula. Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 93.3 °C
2.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Gray; "B" Tan
Mix Ratio By Weight 100/100
Set-Up Time, minutes 45-60
At Room Temperature
Viscosity Paste
Room Temperature
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