Master Bond EP21TDC-2AO Flexibilized, Thermally Conductive Two Component Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy, Thermally Conductive
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21TDC-2AO Flexibilized, Thermally Conductive Two Component Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with an easy to use one to three mixing ratio by weight. The cured compound exhibits a high elongation (greater than 25%), truly exceptional for a thermally conductive epoxy.

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-73.3 °C	-100 °F

Processing Properties	Metric	English	Comments
Cure Time	180 min @Temperature 93.3 °C	3.00 hour @Temperature 200 °F
	2880 - 4320 min @Temperature 23.0 °C	48.0 - 72.0 hour @Temperature 73.4 °F

Descriptive Properties	Value	Comments
Color Code	"A" White; "B" Off White
Mix Ratio By Weight	33/100
Set-Up Time, minutes	90-120	At Room Temperature
Viscosity	Paste	Room Temperature

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