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Master Bond EP21TDC-2AO Flexibilized, Thermally Conductive Two Component Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy, Thermally Conductive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21TDC-2AO Flexibilized, Thermally Conductive Two Component Epoxy.pdf
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Material Notes:
Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with an easy to use one to three mixing ratio by weight. The cured compound exhibits a high elongation (greater than 25%), truly exceptional for a thermally conductive epoxy.
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -73.3 °C
-100 °F
Processing Properties Metric English Comments
Cure Time 180 min

@Temperature 93.3 °C
3.00 hour

@Temperature 200 °F
2880 - 4320 min

@Temperature 23.0 °C
48.0 - 72.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" White; "B" Off White
Mix Ratio By Weight 33/100
Set-Up Time, minutes 90-120
At Room Temperature
Viscosity Paste
Room Temperature
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