Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the EP21TDCS has a one-to-one mix ratio, by weight or volume. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents.

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	>= 5.86 MPa	>= 850 psi	shear, Al/Al
	>= 5.86 MPa	>= 850 psi	shear, Al/Al, after 30 days water immersion
Peel Strength	>= 1.75 kN/m	>= 10.0 pli

Thermal Properties	Metric	English
Thermal Conductivity	1.59 W/m-K	11.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	135 °C	275 °F
Minimum Service Temperature, Air	-269 °C	-452 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.0010 ohm-cm	<= 0.0010 ohm-cm

Processing Properties	Metric	English	Comments
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
	1440 - 2160 min @Temperature 23.9 °C	24.0 - 36.0 hour @Temperature 75.0 °F
Pot Life	30 - 40 min	30 - 40 min	50 grams mass
Shelf Life	6.00 Month	6.00 Month	in glass jar
	3.00 Month @Temperature 23.9 °C	3.00 Month @Temperature 75.0 °F	in syringe

Descriptive Properties	Value	Comments
Mixing Ratio (A to B)	1/1
Viscosity	smooth paste

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