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Master Bond EP29LPSP Low Outgassing, Optically Clear Two Component Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP29LPSP Low Outgassing, Optically Clear Two Component Epoxy.pdf
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Material Notes:
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at temperatures as low as 4K as an adhesive, sealant and protective coating, but more importantly, it is able to withstand cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).
Physical Properties Metric English Comments
Viscosity 700 cP

@Temperature 23.0 °C
700 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -269 °C
-453 °F
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Processing Properties Metric English Comments
Cure Time 480 - 720 min

@Temperature 65.6 °C
8.00 - 12.0 hour

@Temperature 150 °F
7200 - 10100 min

@Temperature 23.0 °C
120 - 168 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Clear; "B" Translucent
Mix Ratio By Weight 100/65
Set-Up Time, minutes min 360
At Room Temperature
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