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Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. Master Bond Polymer System EP30LV produces high strength, rigid bonds which are resistant to chemicals including water, oil and most organic solvents, as well as cold sterilants, ETO and gamma radiation. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. The color of part A is clear and part B clear. Master Bond Polymer System EP30LV is widely used in electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries. Product Advantages: Convenient mixing: easy-to-use mix ratio, five (5) to one (1) by weight. Exceptionally high physical strength properties . Easy application: contact pressure only required for cure, adhesive spreads readily. Versatile cure schedules: ambient temperature cures or fast, elevated temperature cures as required. High bonding strength to a wide variety of substrates. Superior dimensional stability and chemical resistance.Information provided by MasterBond®
Physical Properties Metric English Comments
Water Absorption <= 0.50 %
<= 0.50 %
7 days immersion
Viscosity 200 - 300 cP
200 - 300 cP
Part A
300 - 400 cP
300 - 400 cP
Part B
Mechanical Properties Metric English Comments
Tensile Strength at Break >= 65.5 MPa
>= 9500 psi
Tensile Modulus >= 2.76 GPa
>= 400 ksi
Shear Strength >= 21.5 MPa
>= 3120 psi
Bond, Al to Al, after 30 days water absorption
>= 22.1 MPa
>= 3200 psi
Bond, Al to Al
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Dielectric Constant 3.35

@Frequency 1000 Hz,
Temperature 23.0 °C
3.35

@Frequency 1000 Hz,
Temperature 73.4 °F
3.44

@Frequency 1.00e+6 Hz,
Temperature 23.0 °C
3.44

@Frequency 1.00e+6 Hz,
Temperature 73.4 °F
3.55

@Frequency 60.0 Hz,
Temperature 23.0 °C
3.55

@Frequency 60.0 Hz,
Temperature 73.4 °F
Dielectric Strength 17.3 kV/mm
440 kV/in
Dissipation Factor 0.0050

@Frequency 60.0 Hz,
Temperature 23.0 °C
0.0050

@Frequency 60.0 Hz,
Temperature 73.4 °F
0.0060

@Frequency 1000 Hz,
Temperature 23.0 °C
0.0060

@Frequency 1000 Hz,
Temperature 73.4 °F
0.038

@Frequency 1.00e+6 Hz,
Temperature 23.0 °C
0.038

@Frequency 1.00e+6 Hz,
Temperature 73.4 °F
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 100 °C
2.00 - 3.00 hour

@Temperature 212 °F
960 - 1440 min

@Temperature 40.0 °C
16.0 - 24.0 hour

@Temperature 104 °F
1440 - 2160 min

@Temperature 23.9 °C
24.0 - 36.0 hour

@Temperature 75.0 °F
85% of maximum strength developed
Pot Life 45 - 60 min
45 - 60 min
200 gram batch
60 - 75 min
60 - 75 min
100 gram batch
Shelf Life 12.0 Month

@Temperature 23.9 °C
12.0 Month

@Temperature 75.0 °F
in unopened container
Descriptive Properties Value Comments
Mixing Ratio (A to B) 5/1
by weight
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