Master Bond EP40 High Shear and Peel Strength, Two Component, Flexible Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced , Epoxy, Cast, Unreinforced
Manufacturer	Master Bond Inc.
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP40 High Shear and Peel Strength, Two Component, Flexible Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Master Bond Polymer System EP40 is newly developed two component highly flexible epoxy compound for high performance bonding, potting, encapsulation, and sealing with outstanding shear and peel strength. It features excellent adhesion to engineering plastics as well as metals and various other substrates. EP40 forms high performance flexible bonds, seals and castings that offer excellent retention of physical, electrical and chemical properties even after prolonged exposure to unfavorable environmental conditions.

Physical Properties	Metric	English	Comments
Viscosity	6000 - 6500 cP	6000 - 6500 cP	mixed

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	50 - 55	50 - 55
Tensile Strength	8.27 - 10.3 MPa	1200 - 1500 psi
Elongation at Break	110 %	110 %
Tensile Modulus	0.827 GPa	120 ksi
Shear Strength	7.58 MPa	1100 psi	Tensile lap, Polycarbonate/Polycarbonate
	14.2 MPa	2060 psi	lap, steel/steel
Peel Strength	>= 3.51 kN/m	>= 20.0 pli	polycarbonate/polycarbonate
	>= 7.89 kN/m	>= 45.0 pli	steel/steel

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	113 °C	235 °F
Minimum Service Temperature, Air	-73.3 °C	-100 °F

Electrical Properties	Metric	English
Volume Resistivity	>= 1.00e+8 ohm-cm @Temperature 100 °C	>= 1.00e+8 ohm-cm @Temperature 212 °F
	>= 1.00e+12 ohm-cm @Temperature 25.0 °C	>= 1.00e+12 ohm-cm @Temperature 77.0 °F
Dielectric Constant	4.07 @Frequency 60.0 Hz, Temperature 25.0 °C	4.07 @Frequency 60.0 Hz, Temperature 77.0 °F
	4.12 @Frequency 1000 Hz, Temperature 100 °C	4.12 @Frequency 1000 Hz, Temperature 212 °F
Dielectric Strength	21.7 kV/mm @Thickness 2.03 mm	550 kV/in @Thickness 0.0800 in
Dissipation Factor	0.0070 @Frequency 100000 Hz, Temperature 25.0 °C	0.0070 @Frequency 100000 Hz, Temperature 77.0 °F

Processing Properties	Metric	English	Comments
Cure Time	1080 - 1440 min @Temperature 23.9 °C	18.0 - 24.0 hour @Temperature 75.0 °F	ambient temperatures
	1800 - 3600 min @Temperature 121 °C	30.0 - 60.0 hour @Temperature 250 °F
Pot Life	100 - 120 min	100 - 120 min	100 gram mass
Shelf Life	12.0 Month	12.0 Month	in unopened containers

Descriptive Properties	Value	Comments
Mixing Ratio (A to B)	1/1

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