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Momentive Performance Materials HBN Hot-Pressed Boron Nitride

Category Ceramic , Nitride
Manufacturer Momentive Performance Materials (Former GE Advanced Ceramics)
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Momentive Performance Materials HBN Hot-Pressed Boron Nitride.pdf
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Material Notes:
Hot-pressed BN is compacted at temperatures up to 2000°C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined. It is available in standard and custom hot-pressed shapes and has several unique characteristics and physical properties which make it valuable for solving tough problems in a wide range of industrial applications.Four Material Grades HBC and HBT are the highest purity hot-pressed boron nitrides commercially available. They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up, and low loss tangent which makes them ideal for electronic applications. Grade HBT, although lower in strength and density than HBC, is available in larger sizes, at lower cost, and usually with a shorter delivery schedule. Grade HBN uses small amounts of boric oxide as a binder and should be used in applications where hydration and thermal shock are not a concern. Grade HBR uses calcium borate as a binder and is less sensitive to moisture.Thermal Management The unique combination of being both an excellent electrical insulator and thermal conductor makes BN very useful as a heat sink in high power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, yet is easier to form and finish.High Temperature Applications Temperature stability and excellent resistance to thermal shock makes BN the material of choice in the toughest high temperature applications such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.Molten Metal HandlingBN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make useful in various molten metal processes.Information provided by Momentive Performance Materials, formerly GE Advanced Ceramics.
Physical Properties Metric English Comments
Density 2.10 g/cc
0.0759 lb/in³
typical
Binder Melting Point 550 °C
1020 °F
Moisture Absorption at Equilibrium 3.5 %
3.5 %
400 hours, 100% RH
Open Porosity 7.0 %
7.0 %
Mechanical Properties Metric English Comments
Hardness, Knoop 19
19
100 g
Modulus of Elasticity 62.7 GPa
9090 ksi
Perpendicular to pressing direction
77.9 GPa
11300 ksi
Parallel to pressing direction
Flexural Strength 75.8 MPa
11000 psi
Perpendicular to pressing direction
89.6 MPa
13000 psi
Parallel to pressing direction
Compressive Strength 110.3 MPa
16000 psi
Parallel to pressing direction
124.1 MPa
18000 psi
Perpendicular to pressing direction
Thermal Properties Metric English Comments
CTE, linear 4.00 µm/m-°C

@Temperature 25.0 - 1500 °C
2.22 µin/in-°F

@Temperature 77.0 - 2730 °F
Parallel to pressing direction
CTE, linear, Transverse to Flow 6.00 µm/m-°C

@Temperature 25.0 - 1500 °C
3.33 µin/in-°F

@Temperature 77.0 - 2730 °F
Perpendicular to pressing direction
Specific Heat Capacity 0.808 J/g-°C
0.193 BTU/lb-°F
1.846 J/g-°C

@Temperature 700 °C
0.4412 BTU/lb-°F

@Temperature 1290 °F
Thermal Conductivity 33.0 W/m-K
229 BTU-in/hr-ft²-°F
Perpendicular to pressing direction
59.0 W/m-K
409 BTU-in/hr-ft²-°F
Parallel to pressing direction
Maximum Service Temperature, Air 550 - 850 °C
1020 - 1560 °F
oxidizing atmosphere
Maximum Service Temperature, Inert 550 - 1600 °C
1020 - 2910 °F
Inert/Vacuum
Electrical Properties Metric English Comments
Electrical Resistivity >= 1.00e+15 ohm-cm
>= 1.00e+15 ohm-cm
Dielectric Constant 4.2

@Frequency 1e+6 Hz
4.2

@Frequency 1e+6 Hz
Dielectric Strength 53.0 kV/mm
1350 kV/in
Dissipation Factor <= 0.00020

@Frequency 1e+6 Hz
<= 0.00020

@Frequency 1e+6 Hz
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