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Momentive Performance Materials TSE3261-G Heat Resistant Silicone Adhesive

Category Polymer , Adhesive , Thermoset , Silicone , Silicone, RTV, Adhesive/Sealant Grade
Manufacturer Momentive Performance Materials (Former GE Silicones)
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Momentive Performance Materials TSE3261-G Heat Resistant Silicone Adhesive.pdf
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Material Notes:
TSE3261-G is a one-component heat curable silicone adhesive designed for high temperature applications. TSE3261-G adheres well to a variety of substrates such as metals, plastics, ceramics and glass without the use of a primer.Cured properties for specimen cured 1 hour at 150°C.Key Performance Properties: Ready to use - one componentExcellent high temperature resistanceHeat accelerated cureExcellent adhesive properties; primerless adhesion to many types of substratesGray colorNon corrosive to metals Applications: Sealing and bonding for high temperature applicationsHeatersSteam IronsMicrowave OvensSealing, bonding and potting for electrical appliances and electronic parts. GE Silicones became a part of Momentive Performance Materials in 2006.
Physical Properties Metric English Comments
Specific Gravity 1.48 g/cc
1.48 g/cc
at 23°C
Viscosity 80000 cP
80000 cP
Mechanical Properties Metric English Comments
Hardness, Shore A 54
54
Tensile Strength at Break 4.90 MPa
711 psi
Elongation at Break 160 %
160 %
Adhesive Bond Strength 1.77 MPa
257 psi
Aluminum lap shear
Thermal Properties Metric English Comments
Thermal Conductivity 0.410 W/m-K
2.85 BTU-in/hr-ft²-°F
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+15 ohm-cm
2.00e+15 ohm-cm
Dielectric Constant 3.3
3.3
Dielectric Strength 22.0 kV/mm
559 kV/in
Dissipation Factor 0.020
0.020
Descriptive Properties Value Comments
Color Gray
Consistency Flowable
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