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NBE nanoTach® Nano-Silver Paste, Lead-Free Solder Alternative

Category Metal , Nonferrous Metal , Precious Metal , Silver Alloy , Solder/Braze Alloy
Manufacturer NBETech
Trade Name nanoTach®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF NBE nanoTach® Nano-Silver Paste, Lead-Free Solder Alternative.pdf
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Material Notes:
NanoTach® is a thick paste of nano-sized silver powder in an organic binder that can be used as an alternative to solder or epoxy in semiconductor devices in the state-of-the-art individual packages or multi-chip power modules. NBE’s lead-free nanomaterial attachment possesses better thermal, mechanical and electrical properties than soldered or epoxied alternatives. The attachment process is completely compatible with existing equipment and facilities that use solders or epoxies. Using NBE’s material and process, high power-density semiconductor electronic or optoelectronic devices can be operated at high temperatures in excess of 250° C, not attainable with any existing solder-based or epoxy-based materials. Specific applications can include bonding to large chips for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, and RF power devices.Compared to the current die-attach materials, nanoTach® offers:5x higher thermal and electrical properties> 250° C capability< 275° C ambient or low pressure (5 MPa) processingImproved reliability from low elastic modulusOne-to-one RoHS compliant replacements.
Physical Properties Metric English Comments
Density >= 3.50 g/cc
>= 0.126 lb/in³
Before Sintering
>= 7.90 g/cc
>= 0.285 lb/in³
After Sintering
Solids Content >= 78.5 %
>= 78.5 %
Before Sintering
Porosity <= 25 %
<= 25 %
After Sintering
Viscosity 750000 cP
750000 cP
Before Sintering
Mechanical Properties Metric English Comments
Modulus of Elasticity 10.0 - 30.0 GPa
1450 - 4350 ksi
After Sintering
Adhesive Bond Strength >= 20.0 MPa
>= 2900 psi
Chip Bonding
Thermal Properties Metric English Comments
CTE, linear 19.6 µm/m-°C
10.9 µin/in-°F
After Sintering
Thermal Conductivity >= 2.00 W/m-K
>= 13.9 BTU-in/hr-ft²-°F
Melting Point 961 °C
1760 °F
After Sintering
Maximum Service Temperature, Air <= 961 °C
<= 1760 °F
mp of silver
Electrical Properties Metric English Comments
Electrical Resistivity 0.00000260 ohm-cm
0.00000260 ohm-cm
Processing Properties Metric English Comments
Sintering Temperature <= 275 °C
<= 527 °F
Shelf Life 12.0 Month
12.0 Month
Descriptive Properties Value Comments
Color Dark Gray
Before Sintering
RoHS Compliancy Compliant
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