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Park Electrochemical Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Park Electrochemical Corp.
Trade Name Nelco®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Park Electrochemical Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg.pdf
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Material Notes:
The Nelco N7000-2 HT laminate and N7000-3 prepreg are a series of toughened polyimide materials for use in high-reliability multilayers. This combined resin system provides excellent thermal performance, improved processing characteristics and is exceptional for use in a wide variety of applications that include fine geometry multilayer constructions and extreme reliability requirements.Key Features and Benefits:Polyimide resin chemistryLead-free assembly compatibilitySupports current and previous military and industrial standardsReliable plated-through holesReliable processingApplications/Qualifications:Fine-Line MultilayersBackplanesSurface-Mount MultilayersBGA MultilayersDirect Chip AttachUnderhood AutomotiveBurn-in BoardsInformation provided by Park Electrochemical Corp.
Physical Properties Metric English Comments
Density 1.70 g/cc
0.0614 lb/in³
50% Resin Content; Internal Method
Water Absorption 0.35 %
0.35 %
IPC-TM-650.2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 21.4 GPa
3100 ksi
X; ASTM D3039
22.8 GPa
3300 ksi
Y; ASTM D3039
Poissons Ratio 0.146
0.146
X; ASTM D3039
0.153
0.153
Y; ASTM D3039
Peel Strength 1.23 kN/m
7.00 pli
at elevated temperature; IPC-TM-650.2.4.8.2a
1.23 kN/m
7.00 pli
after exposure to process solutions; IPC-TM-650.2.4.8
1.31 kN/m
7.50 pli
after solder float; IPC-TM-650.2.4.8
Thermal Properties Metric English Comments
CTE, linear 9.00 - 12.0 µm/m-°C

@Temperature -40.0 - 125 °C
5.00 - 6.67 µin/in-°F

@Temperature -40.0 - 257 °F
IPC-TM-650.2.4.41
Specific Heat Capacity 1.05 J/g-°C
0.250 BTU/lb-°F
ASTM E1461
Thermal Conductivity 0.450 W/m-K
3.12 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 250 °C
482 °F
TMA; IPC-TM-650.2.4.24c
260 °C
500 °F
DSC; IPC-TM-650.2.4.25c
Decomposition Temperature 376 °C
709 °F
5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
C - 96/35/90; IPC-TM-650.2.5.17.1
1.00e+13 ohm-cm
1.00e+13 ohm-cm
E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohm
1.00e+13 ohm
C - 96/35/90; IPC-TM-650.2.5.17.1
1.00e+13 ohm
1.00e+13 ohm
E - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 3.5

@Frequency 2.50e+9 Hz
3.5

@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
3.5

@Frequency 1.00e+10 Hz
3.5

@Frequency 1.00e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
3.5

@Frequency 1.00e+10 Hz
3.5

@Frequency 1.00e+10 Hz
Split Post Cavity
3.8

@Frequency 1.00e+9 Hz
3.8

@Frequency 1.00e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength 47.2 kV/mm
1200 kV/in
IPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V
>= 50000 V
IPC-TM-650.2.5.6
Dissipation Factor 0.0090

@Frequency 1.00e+10 Hz
0.0090

@Frequency 1.00e+10 Hz
Split Post Cavity
0.015

@Frequency 2.50e+9 Hz
0.015

@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
0.015

@Frequency 1.00e+10 Hz
0.015

@Frequency 1.00e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 100 sec
100 sec
IPC-TM-650.2.5.1
Descriptive Properties Value Comments
Methylene Chloride Resistance (% Weight Change) <0.50
IPC-TM-650.2.3.4.3
Pressure Cooker Pass
60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes) 12+
IPC-TM-650.2.4.24.1
Z Axis Expansion (%) <2.5
50ºC to 260ºC; IPC-TM-650.2.4.41
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