Parker Chomerics CHO-BOND 1024 Conductive Silicone Splicing Compound

Category	Polymer , Adhesive , Thermoset
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 1024 Conductive Silicone Splicing Compound.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silicone binder. Applications: THERMATTACH have been designed to provide a high performance bond in the assembly of EBGA and TBGA semiconductor packages. Their thermally conductive filler ensures superior package performance when used to bond the flex or laminate substrate to stiffeners and heat spreaders.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Density	3.20 g/cc	0.116 lb/in³
Solubility in Water	0.00 %	0.00 %	Insoluble

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Processing Properties	Metric	English	Comments
Pot Life	30 min @Temperature 24.0 °C	30 min @Temperature 75.2 °F
	20160 min @Temperature -35.0 °C	20160 min @Temperature -31.0 °F
Shelf Life	6.00 Month	6.00 Month	Parts A & B

Descriptive Properties	Value	Comments
Part A/B/C %	23/3.5/73.5

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