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Parker Chomerics CHO-BOND SV712 Conductive Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND SV712 Conductive Epoxy.pdf
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  Online Service   lookpolymers   27660005
Material Notes:
CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. They are one-component systems with a unique combination of excellent die shear strength, low coefficients of thermal expansion, ionic purity, and high thermal and electrical conductivities. Each offers and extended working life with viscosity and thixotropy suitable for both time/pressure and positive displacement dispensing methods. CHO-BOND® SV712 die attach adhesive has been optimized for high-speed, automated dispensing. It exhibits no resin bleed out on a variety of substrates and metallizations. Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 3.00 - 3.60 g/cc
3.00 - 3.60 g/cc
Volatile Organic Compounds (VOC) Content 0.00 g/l
0.00 g/l
Solubility in Water 0.00 %
0.00 %
Insoluble
Thickness 25.4 microns
1.00 mil
Recommended
Mechanical Properties Metric English Comments
Shear Strength >= 7.58 MPa
>= 1100 psi
Lap
>= 33.1 MPa
>= 4800 psi
Die
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -45.0 °C
-49.0 °F
Flash Point >= 93.3 °C
>= 200 °F
Component Elements Properties Metric English Comments
Silver, Ag 60 - 85 %
60 - 85 %
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00040 ohm-cm
<= 0.00040 ohm-cm
DC
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Amine Compound Proprietary wt. % Max 5
Binder Epoxy
Consistency Thixotropic Paste
Epoxy Resin, wt % 15 - 25
Filler Ag
Mix Ratio 1-part
o-Cresyl glycidyle ether wt. % Max 10
Work Life 4 weeks
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