Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Parker Chomerics CHO-FLEX 601 Conductive Coating

Category Polymer , Thermoset , Polyurethane, TS
Manufacturer Parker Chomerics
Trade Name CHO-FLEX
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-FLEX 601 Conductive Coating.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
CHO-FLEX™ 601 coating is specifically designed for EMI shielding of copper/Kapton flexible circuit laminates and for printing circuits on Kapton film. Upon cure, this coating exhibits excellent adhesion and flexibility, thermal stability, high conductivity, and superior peel strength. CHO-FLEX™ 601 coating can be sprayed or silkscreened, and will withstand wave solder temperatures above 500°F (260°C) without losing any of its exceptional propertiesInformation provided by Chomerics
Physical Properties Metric English Comments
Density 1.67 g/cc
0.0603 lb/in³
Solids Content 58 %
58 %
Thermal Properties Metric English Comments
Maximum Service Temperature, Air >= 107 °C
>= 225 °F
Electrical Properties Metric English Comments
Volume Resistivity 0.00015 ohm-cm

@Thickness 0.0254 mm
0.00015 ohm-cm

@Thickness 0.00100 in
film
Surface Resistivity per Square <= 0.050 ohm

@Thickness 0.0254 mm
<= 0.050 ohm

@Thickness 0.00100 in
film
Processing Properties Metric English Comments
Cure Time 3.00 min

@Temperature 260 °C
0.0500 hour

@Temperature 500 °F
Wave Solder
90.0 min

@Temperature 182 °C
1.50 hour

@Temperature 360 °F
300 min

@Temperature 163 °C
5.00 hour

@Temperature 325 °F
Initial Cure
5400 min

@Temperature 182 °C
90.0 hour

@Temperature 360 °F
Press Cycle
Shelf Life 6.00 Month
6.00 Month
Descriptive Properties Value Comments
Adhesion 5B
ASTM D3359-78
Binder Polyurethane
Consistency Thixotropic Paste
Filler Ag
Resin Polyurethane
Theoretical Coverage 4320 in2 / lb
Actual coverage will be 50-100%
Copyright © lookpolymers.com All Rights Reserved